熱導產業技術發展軌跡之探討 — 以YCTC公司為例 —

Research of the Developing Trend of Industry's Technology for the Thermal Module - A Case Study of YCTC Corporation

邱進連(CHIN-LIEN CHIU)

指導教授 ： 耿筠

中原大學/商學院/企業管理研究所/碩士(2009年)

https://doi.org/10.6840/cycu200900027

摘要

在我國熱導產業以群聚之地理優勢與優異的技術能力，以及積極的技術研發創新發展，使我國在熱導產業領域締造在國際市場上能見度。本研究論文是以個案方式；分析探討產業之技術能力發展、企業營運策略、技術的發展、技術的生命週期、技術擴散延伸，以及技術移轉的軌跡探討方向，以選定在我國在熱導產業當中以佔有關鍵熱導元件產業廠家為本個案研究對象，其目的如下：
（一） 探討科技產業技術能力的擴散與技術移轉之策略。
（二） 藉由個案分析對熱導產業供應鏈角色之特徵，分析產品生命週期與技術延伸競爭策略。
本論文係以我國熱導產業為範疇，基礎是以個人電腦（PC）產業上游供應鏈關係為主軸，熱導產業之「散熱」元件廠商規模。在2006年時期，我國熱導產業之產值(包含大陸台商)估計達到約新台幣800億元產值，並且佔全球市場七成以上的產量。對於未來，在個人電腦（PC）及遊戲機等資訊產品的市場持續成長下，加上3C產業增加對散熱技術產品的需求，熱導產業將持續有成長空間，是可期待的。
由本研究個案公司分析了解，企業在技術運用與生命週期各階段性背景策略推行下是產業成長的重要指標性過程。對於個案企業雖經多次經營權改變，其企業營運策略進展、目標方向、顯有差異。面對於海外投產之技術移轉是個案企業策略實現，也是企業技術轉移大陸的移轉傾向操作，是企業經營實際務實、技術移轉的成效，將接各樣受嚴酷考驗。對於個案公司在技術能力、技術移轉、企業經營策略的務實表現，能為熱導產業得到些啟示，是本研究探討動機與目的。

關鍵字

散熱模組 ； 熱導管 ； 技術移轉 ； 產業生命週期 ； 經營策略

並列摘要

In Taiwan thermal conductivity to clusters of industries and geographical advantage of the excellent technical ability and positive development of technology research and innovation, making Taiwan the thermal conductivity in the field to create visibility in the international market, The research papers on case by case basis, analysis of industry, technology development, business operations strategy and technology development, technology life cycle, extending the spread of technology and technology transfer on the track of the direction in Taiwan to selected industries in the thermal conductivity Among thermal conductivity to occupy key components industry-based manufacturers case study, its purpose is as follows:

(A) Technical capabilities of the technology industry and the proliferation of technology transfer strategy.
(B) By case analysis of the thermal conductivity of the industry supply chain role of the characteristics of the product life cycle and technical extension of competitive strategy.

This paper is based on Taiwan's industries as the areas of thermal conductivity, based on the personal computer (PC) industry upstream supply chain relationships as the principal axis, the thermal conductivity of the industry, "cooling" component manufacturer’s scale. In the 2006 period, Taiwan's industrial output value of thermal conductivity (including Taiwan businessmen in mainland China) is estimated at about 80 billion output value of NT$, and more than 70% of the global market the output. For the future, in the personal computer (PC) and game consoles, and other information products in the market continued to grow, with 3C industry to increase the demand for cooling technology products, thermal conductivity industry will continue to have room to grow, can be anticipated.
The case study from the company of understanding and the use of technology enterprises in the life cycle of the phased implementation strategy under the background is an important indicator of industrial growth of the process. For cases enterprises the right to operate, despite repeated changes in its business operations strategy for progress in the direction of goals, there are significant differences. Overseas production in the face of technology transfer cases is the realization of corporate strategy, business technology transfer is also the mainland's tendency to transfer operation is practical and pragmatic business, the effectiveness of technology transfer, and then everything will be subject to rigorous tests. For cases in technical capacity, technology transfer, business strategy and pragmatic performance for the thermal conductivity industries more enlightenment, this study is the motivation and purpose.

並列關鍵字

cooling modules ； heat pipe ； industry life cycle management strategy ； technology transfer

參考文獻

8. 張志立(2004),「以技術生命週期作為技術預測模式之比較」，中原大學企業管理研究所未出版碩士論文。

1. 唐瑞昌(2008)，「台灣印刷電路板產業競爭策略之分析」，中原大學企業管理學系未出版碩士論文。

1. Seok Hwan Moon , Gunn Hwang, Ho Gyeong Yun, Tae Goo Choy,Young II Kang（2002）,”Improving thermal performance of miniature heat pipe for notebook PC cooling ”,Microelectronics Reliability VOI.42, PP.135-140.

2. Jaroslaw Legierski , Boguslaw Wiecek , Gilbert de Mey（2006）,”Measurements and simulations of transient characteristics of heat pipes ”Microelectronics Reliability Vol.46, PP.109-ll5.

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