溫度循環因子對IC封裝之錫球材料可靠度的影響

由於全球高科技產業的升級，傳統的封裝方式已經無法滿足數位電子產品朝向輕薄短小的需求，為了符合高密度構裝、細間距與高可靠度等要求，因此在封裝製程上亦面臨許多新的挑戰，溫度循環所產生之熱應力與疲勞及電子產品受裂縫影響等元件毀損問題，都亟欲解決。本文一開始時引用文獻來做一連串的比對驗證，以確保本文研究內涵的可信度；首先主要利用有限元素分析軟體(ANSYS)及田口方法，為了解不同封裝模型的疲勞壽命受熱循環測試下的影響，規劃包含5個因素分別為高溫恆溫溫度、低溫恆溫溫度、升溫和降溫率、高溫恆溫時間和低溫恆溫時間，具有四個水準的L16 直交表，並以三種不同封裝體分別為PBGA-256、PBGA-388和CCGA-1657當作誤差因子；於此田口方法分析的重點不在最佳化的論述，而是要探討出無鉛銲料之溫度循環因子對封裝體可靠度的影響，以期供給未來制定溫度循環測試更多的資訊。第二部分為利用有限元素軟體ANSYS模擬PBGA-388封裝的錫球裂縫模型，分析其主要的潛變效應對封裝體之影響；研究有裂縫模型的應力-應變相互關係與模擬分析之討論，以及不同裂縫初始或成長長度對疲勞壽命的影響。

關鍵字

有限元素分析；無鉛銲錫；田口方法；溫度循環；裂縫；疲勞壽命

並列摘要

Electronic packages nowadays are becoming smaller, lighter with higher I/O count and better performance that are more cost competitive. Therefore, some critical problems under temperature cycles need to be addressed to improve the qualities of IC devices. As a beginning, this paper will compare a series of results of the literature to prove the correctness of the article and ensure this research credibility. The first part of this study will use finite element analysis and Taguchi method to understand the influences of the temperature cycling loading on fatigue life of three different IC packages. A L16 Taguchi array contains five factors, and each one has four levels, then the noise factors are three package models, namely PBGA-256, PBGA-388, and CCGA-1657, respectively. The purpose of investigation with Taguchi method is not to obtain the optimum parameters of the thermal cycling and it is to examine the effects of temperature cycling parameter of solder joint reliability for these lead-free materials. It can be expected to obtain more information of thermal cyclic test in order to set up the future criterion on the IC package industry. The second part of this study will use finite element analysis to simulate PBGA-388 package with the crack length for solder ball and solder column to study the transformations of creep behaviors such as shear stress, creep shear strain, hysteresis loop and creep strain energy density. Besides, different crack length affecting variations of fatigue life in three high-density package assemblies is also investigated in this study.

並列關鍵字

Temperature Cyclic Loading ； Finite Element Analysis、Lead-Free Solder Bump、Taguchi M ； Crack ； Fatigue Life

參考文獻

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溫度循環因子對IC封裝之錫球材料可靠度的影響

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