應用於印刷電路板壓黏之高頻感應加熱器設計

Design of High Frequency Induction Heater Applied to Circuit Boards Bonding

謝尚宏(SHANG-HUNG HSIEH)

指導教授 ： 何金滿

中原大學/工學院/電機工程研究所/碩士(2007年)

https://doi.org/10.6840/cycu200700255

摘要

應用感應加熱的技術已可達到系統上的高效率、高品質與低污染之特性，並且加熱處理技術已在相關領域中佔有一席重要之地位，尤其應用在金屬表面快速加熱部份。
本篇論文對於印刷電路板的壓黏設計中較重要的加熱物件特性，於實驗中有詳細分析說明，實驗架構為電壓饋入式全橋式電源轉換裝置，應用於負載串聯共振式感應加熱系統之上，功率開關具備零電壓切換的性能，具降低功率開關切換應力、切換損失及改善電磁干擾現象等特點，成功達到提高加熱效率之目的。
最後，本研究將對感應加熱系統其操作特性與整體效率進行說明與量測，同時對於加熱物件的加熱效果做一探討。

關鍵字

感應加熱 ； 印刷電路板壓黏

並列摘要

Using induction heating could reach a high efficiency, high quality, and low pollution system . The heating technique is important in related fields,especially in the rapid heating on the surface of metal.
In this thesis, we discuss the bonding of circuit boards by high frequency induction heating. A load series resonant induction heating system with voltage source full bridge inverter has been constructed and tested . The
system can reach reducing switching losses, component stress, and electromagnetic interference of power semiconductor devices, therefore high heating efficiency is reached.
Finally, the control characteristics and whole efficiency were measured and analyzed.

並列關鍵字

induction heating ； bonding of circuit boards

參考文獻

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