透過您的圖書館登入
IP:3.19.27.178
  • 學位論文

電漿輔助化學氣相沉積法製備疏水疏油薄膜之研究

Fabrication of hydrophobic and oleophobic films by Plasma Enhanced Chemical Vapor Deposition

指導教授 : 魏大欽

摘要


本研究使用電漿輔助化氣相沉積法製備氟碳沉積膜與有機矽氧烷沉積膜,以八氟環丁烷 (C4F8)、六甲基二矽氧烷(HMDSO)與四甲氧基矽烷(TMOS)為成膜前驅物,為調控膜材特性改變有機矽氧烷類單體(TMOS、HMDSO)與氧氣進料流量比例沉積於玻璃基材上;C4F8則使用不同電漿激發方式(連續式、脈衝式)沉積氟碳膜於玻璃基材上。並利用CA、SEM、XPS、FTIR、鉛筆硬度與方格測試等分析表面物理型態、化學組成變化、機械強度(鉛筆硬度、附著力)與疏水及疏油性質。 研究發現於HMDSO/O2電漿沉積膜,隨著氧氣流量比例增加,其水接觸角從101.15°減少為71.67°,從疏水變為親水性質,而C/Si隨之下降至0.6,表示沉積膜無機結構增加有機結構減少,使其表面硬度也從F提升2H;TMOS/O2電漿沉積膜則隨著氧氣流量比例增加,其水接觸角從70.37°減少為38.34°,更為親水而O/Si也隨之增加為1.51,表示沉積膜無機結構增加有機結構減少,表面結構更接近純SiO2網狀結構,使其表面硬度從H提升4H。但兩者皆無疏油特性,因此使用C4F8電漿沉積氟碳膜於基材上,以功率10 W連續式C4F8電漿與脈衝式(頻率1000 Hz)C4F8電漿之沉積膜,其水接觸角分別為108.75°與112°,FAS水接觸角110.63°皆為疏水性質;而二碘甲烷接觸角測試,脈衝式(頻率1000 Hz)C4F8電漿之沉積膜為95.41°,FAS為92.23°皆為疏油性質。根據ISO14419測試鑑別出脈衝式(頻率1000 Hz)C4F8電漿之沉積膜其疏油程度為等級四。

並列摘要


In this research, the plasma deposited SiOCH films and fluorocarbon films on glass surface were fabricated via HMDSO, TMOS and C4F8 plasma enhanced chemical vapor deposition (PECVD). The depositedfilms characteristics were investigated through contact angle measurement, scanning electron microscopy (SEM), fourier-transform infrared spectroscopy (FTIR), X-ray photoelectron spectroscopy (XPS), pencil hardness test and adhesion cross-cut test. It is found that, as O2 flow rate of the HMDSO/O2 plasma is increased, the water contact angles (WCA) and C/Si atomic ratio of deposited films are decreased from 105.2 to 71.8° and 2.1 to 0.6, respectively, and the pencil hardnessis increased from class F to 2H; Whereas the O2 flow rate of TMOS/O2 plasma is increased, the WCA and C/Si ratio of deposited films are decreased from 70.4 to 38.3° and 1.5 to 0.6, respectively, and the pencil hardnessis increased from H to 4H. Both of HMDSO/O2 and TMOS/O2 plasma deposited films are lipophilic. On the other hand, the C4F8 pulsed-plasma deposited film shows both hydrophobic and oleophobic properties. The WCA, hexadecane contact angles, diiodomethane contact angles, pencil hardness and degree of C4F8 pulsed plasma deposited films are measured as 112°, 64°, 95.4°, 4H and class 4, respectively.

並列關鍵字

hydrophobic oleophobic plasms deposition HMDSO TMOS C4F8

參考文獻


[1] 徐郁璘, "電漿輔助化學氣相沉積法製備有機矽氧烷氣體分離膜之研究," 碩士, 化學工程研究所, 中原大學, 2013.
[2] 楊士賢, "以脈衝式電漿輔助化學氣相沉積法製備氟化非晶碳膜之研究," 碩士, 化學工程研究所, 中原大學, 2005.
[3] 陳榮俊, "四氟乙烷電漿沉積氟碳複合結構薄膜製程之研究," 碩士, 化學工程研究所, 中原大學, 2012.
[9] 施証耀, "以乙炔/氮氣電漿改質高分子氣體分離膜之研究," 碩士, 化學工程研究所, 中原大學, 2001.
[13] 張文豪, "以電漿輔助化學氣相沉積法製備超疏水薄膜及形成機制之研究," 碩士, 化學工程研究所, 中原大學, 2010.

被引用紀錄


陳慶瑜(2017)。以微波電漿製備超疏水及疏油薄膜於平坦基材之研究〔碩士論文,中原大學〕。華藝線上圖書館。https://doi.org/10.6840/cycu201700480

延伸閱讀