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  • 學位論文

錫-銻/鈷-鐵之界面反應與錫-銻-鐵三元系統相平衡

Interfacial Reactions in Sn-Sb/Co-Fe Couples and Phase Equilibria of the Sn-Sb-Fe Ternary System

指導教授 : 陳志吉
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摘要


本論文探討Sn-Sb-Fe三元系統在300oC下之相平衡與Sn-Sb/Co-Fe反應偶之界面反應。在Sn-Sb-Fe三元系統於300oC下之相平衡研究中,共決定出4個三相區、13個兩相區以及10個單相區。Sb於液相、FeSn2、FeSn相中之最大溶解度分別為13.7at%、9.9at%與7.9at%。Sn於Sb相中之最大溶解度約為8.5at%,Fe對於Sn、Sb最大溶解度各約為2at%。其他的穩定相皆無明顯的第三元溶解度。 在Sn-Sb/Co-Fe的整體界面反應研究中,針對Sn-5wt%Sb和Sn-10wt%Sb與不同比例下的Co-xwt%Fe合金基材(x=5, 10)做探討,實驗結果顯示Sn-Sb/Co-Fe界面反應與Sn-Sb/Co不同。在300oC下,當銲料為Sn-5wt%Sb時,界面處生成CoSn3相。當銲料為Sn-10wt%Sb時,在界面處則是生成以Sb為主的生成相CoSb3相與Sn-Sb-Co三元系統的三元穩定相π相,在銲料中析出Sn3Sb2相。固/固界面反應,Sn-5wt%Sb時,在界面處生成π相,反應活化能為15.9kJ/mol; Sn-10wt%Sb時,界面處是生成π相,反應活化能為35.6kJ/mol。各溫度下,在銲料中加入較多的Sb都能夠有效的降低反應速率。 Sn-Sb/Co-Fe界面反應生成CoSb3相,CoSb3為一方鈷礦(Skutterudite)型結構,具有良好的熱電性質,本研究之結果可以提供製備具有良好熱電性質材料之參考。

並列摘要


This thesis investigates the interfacial reactions in Sn-Sb/Co-Fe couples and the phase equilibria of the Sn-Sb-Fe ternary system at 300oC. In Sn-Sb-Fe phase equilibria study at 300oC, 4 three-phase, 13 two-phase, and 10 single-phase regions are determined experimentally. Sb solubility in the liquid, FeSn2 and FeSn phases are 13.7, 9.9, and 7.9at%, respectively. Sn solubility in the Sb phase is about 8.5at%. Fe solubility in the liquid and Sb phases are 2 and 2at%, respectively. No noticeable ternary solubility is found in the other binary phases. The interfacial reactions in Sn-Sb/Co-Fe couples are different from those of Sn-Sb/Co. In Sn-10wt%Sb/Co-Fe couples at 300oC, the reaction phases are the CoSb3 phase and a Sn-Sb-Co ternary phase (π). In Sn-Sb/Co-Fe aging tests, the main reaction phase is the π phase, and the activation energies are 15.9 and 35.6 kJ/mol in Sn-5wt%Sb/Co-Fe and Sn-10wt%Sb/Co-Fe couples, respectively. The reaction phase thickness effectively decreases with greater Sb additions. The CoSb3 phase is a Skutterudite compound, which has good thermoelectric properties. The result of this study can be used as a reference to prepare the thermoelectric materials.

參考文獻


1. Y. C. Liu, J. W. R. Teo, S. K. Tung, and K. H. Lam, Journal of Alloys and Compounds, Vol. 448, pp. 340-343 (2008).
2. V. Chidambaram, J. Hattel, and J. Hald, Materials and Design, Vol. 31, pp.4638-4645 (2010).
3. J. H. Kim, S. W. Jeong, H. M. Lee, Journal of Electronic Materials, Vol. 31, pp. 557-563 (2002).
4. J. H. Kim, S. W. Jeong, H. M. Lee, Materials Transactions, Vol. 43, pp. 1873-1878 (2002).
5. J. W. Jang , P. G. Kim, K. N. Tu, M. Lee, Materials Research Society, Vol. 14, pp. 3895-3900 (1999).

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