印刷電路板訊號連通柱對阻抗及損耗影響

Influence of Impedance and Loss for Signal Via on Printed Circuit Board

鄭崇甫(CHUNG-FU CHENG)

指導教授 ： 薛光華

中原大學/電機資訊學院/電子工程學系/碩士(2022年)

https://doi.org/10.6840/cycu202201326

摘要

隨著印刷電路板層數越來越多，在多層印刷電路板中，不同層之間的訊號傳輸線需要透過訊號連通柱連通訊號。然而，以目前板廠實際印刷電路板常使用的尺寸參數，訊號連通柱的阻抗通常會低於訊號傳輸線的阻抗，因此將導致訊號不完整的問題。本論文將藉由變化訊號連通柱的三個最主要影響其阻抗特性的結構參數—訊號連通柱隔離圈(Anti-pad)直徑、訊號連通柱(Via)直徑與訊號連通柱焊盤(Via Pad)直徑，進行分析與探討，透過了解其相關參數變化與訊號連通柱阻抗及損耗之間的關係，得到可以將隔離圈(Anti-pad)直徑變大、訊號連通柱(Via)直徑變小以及訊號連通柱焊盤(Via Pad)變小，皆能有效提高訊號連通柱阻抗，使其達到與訊號線阻抗匹配，以獲得最佳訊號完整性。

關鍵字

印刷電路板 ； 連通柱

並列摘要

In multi-layer printed circuit boards, the signal transmission lines between different layers need to be connected through signal via. However, with the size specifications commonly used for printed circuit boards in the current industry, the impedance of the signal via is usually lower than the impedance of the signal transmission line, which will cause the problem of incomplete signal. This article will analyze and discuss the three main structural parameters that affect the impedance characteristics of the changing signal via -the diameter of the anti-pad, the diameter of the signal via and the diameter of the signal via pad. By understanding the relationship between the change of related parameters and the impedance of the signal via, it can be obtained that the diameter of the anti-pad becomes larger, the diameter of the signal via becomes smaller, and the diameter of the signal via pad becomes smaller, which can effectively increase the impedance of the signal connecting column and make it to achieve the impedance matching with the signal line to obtain the best signal integrity.

並列關鍵字

PCB ； via

參考文獻

參考文獻

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