本論文探討TFT-LCD顯示器陣列(Array)黃光製程中因設備機構與產品設計上的差異性所造成黃光製程中亮度不均勻痕跡(Mura)的異常現象。 研究之進行乃結合六標準差(Six sigma)專案管理方式-DMAIC改善光阻塗佈製程中產生的Mura,於實驗方法設計上先進行分析會影響製程中關鍵的因子,再運用測試方式調整出最佳製程條件,並進行產品驗證,最終以最佳參數來提升製程能力和產品穩定性,達到降低產品不良率之目的。 由實驗結果得知,壓力於300Pa,為生產穩定條件,大幅減少Pin Mura產生。已達改善後Pin Mura產量損失之目標0.514%,實際產量損失由1.34%降低至0.18%,經由每日點檢、機台保養確認及更換異常零件,可維持設定良率目標並達成產能穩定,節省公司成本,提升客戶滿意度。
This paper explores TFT-LCD Display Array (Array) Yellow light due to the differences in the design of equipment and products caused by the difference in the brightness of the yellow light process in the uneven mark (Mura) an exception to the. Research is a combination of six standard deviations (Six Sigma) Project Management-DMAIC improved optical resistance coating process for Mura, the first analysis in the design of experimental methods will affect the key factors in the process, and then use the test method to adjust the best process components, and product validation, and ultimately with the best parameters to enhance the process capability and product stability, to reduce product adverse rate of purpose. The results of the experiment showed that the pressure was on 300Pa, to produce stable conditions, drastically reduce Pin Mura generated. Up to the improved Pin Mura yield loss target 0.514%, actual output loss from 1.34% down to 0.18%, through the daily inspection, machine maintenance confirmation and replacement of abnormal parts, can maintain set a good rate target and achieve capacity stability, save company costs, improve customer satisfaction.