植入式電子功能器主要由微印刷電路板和電極所組成,為求微印刷電路板不受體內濕氣所破壞,對其密封有其必要。當硼矽玻璃選用為封裝材料,且貴族金屬選用為電極時,熱熔玻璃封裝法經常是首選。然而,二者之熱膨脹係數不同,密封的要求更顯困難。硫醇基丙基三甲氧基矽烷(3-mercaptopropyltrimethoxysilane, MPTMS) 經水解-縮合反應後形成網狀結構,藉此材料具有silane以及thiol兩種官能基,將其塗附於封裝的接口,有助於接合密封玻璃與白金。本課題探討MPTMS對水氣之阻隔能力;探討MPTMS的物理及化學特性外;並以體外細胞實驗與動物實驗來驗證此材料之生物相容性。研究結果顯示,MPTMS對氦氣之滲透率低達 0.3×10-10 cm3.atm/s,將其浸泡於磷酸鹽緩衝溶液中30天後,該材料對於氦氣亦有雷同之阻隔能力。MPTMS體外細胞實驗結果顯示,它不會使巨噬細胞產生發炎反應。MPTMS植入於老鼠的實驗結果顯示,該材料也不會對生物組織有不良反應。本研究證實MPTMS是生物相容性材料,且對氦氣具阻隔性,具有應用於封裝白金電極與玻璃之可行性。
An implantable electronic device mainly consists of miniaturized electronic print circuit boards (μ-PCB) and metal electrodes. To avoid the μ-PCB from damage by moisture within human body, there is a need to encapsulate it hermetically. The electrodes on the other hand must be touched with body tissues. For a device with such component configuration, the contact between packaging materials used and metal electrodes is inevitable. When boron silica is used as the encapsulating material, often the sintering technology is applied. However, due to the different material’s dissimilar thermal expansion coefficients, tiny gaps around the interface are issues to be overcome. MPTMS (3-mercaptopropyltrimethoxysilane) is proposed to close the gaps. The rationale is that MPTMS contains silane and thiol functional groups that can be bonded to boron silica and platinum, respectively. The physical and chemical properties, the moisture penetrability, and the biocompatibility of MPTMS were investigated. The proof of the bonding between MPMPS and platinum was confirmed by the FTIR, SEM and XPS studies. According to the results of the moisture penetration study, MPTMS was able to minimize the helium leak rate to a level of 0.3×10-10 cm3.atm/s. Furthermore, the biocompatibility study results showed that there was no inflammation response in macrophage cultivations with MPTMS. Finally, when MPTMS was implanted into muscles of rats, no adverse reaction evoked was identified. In conclusion, MPTMS has a great potential to serve as a material for the applications of implantable device that require closing the interface gaps between boron silica and platinum electrodes.