IC元件之真空包裝模組機構設計

本文針對之IC產品元件設計真空包裝機，承裝IC元件使用的是托盤，將IC元件進行分量後放入托盤中，進行包裝作業，包裝成品具有保護IC元件避免受潮，在運送過程中避免IC元件因外部的靜電導致產品損毀。此真空包裝機構能以皮帶輸送方式傳送包裝袋與托盤，經過一連串之進袋、開袋、托盤入袋、抽真空、熱壓封口等過程，完成產品之包裝。其關鍵的熱壓封口模組，採用電熱線進行加熱，並輔以機構壓制，使包裝袋封口的品質能穩定。所設計之真空包裝機構經實測兩種包裝袋尺寸的條件，在封口品質穩定的條件下實測最大的包裝能力，在超過最大包裝能力約8層托盤時，發生包裝袋封口失敗的現象，並提出診斷分析造成的原因。本包裝機的作業能力為每小時20袋，且可配合包裝袋口的寬度260mm至300mm。所開發之真空包裝機構可降低人為的不穩定操作造成的包裝袋真空洩漏，提昇包裝產能。

關鍵字

IC 托盤；真空包裝；包裝機；真空封口

並列摘要

In this article, a vacuum packaging machine is designed. IC components are sorted and loaded on the trays for later packaging. The packaged product is able to protect the IC component from moisture, and avoid from damage due to external static electricity during transportation. The vacuum packaging machine can transport the packaging bag and the tray by belt conveyer. Through a series of processes include feeding the bag, opening the bag, inserting the bag into the bag, vacuuming, and sealing the heat, packaging is completed. The hot-press sealing module is the key subsystem provides heat source by electric heating wire associated with suppress mechanism in order to maintain a steady quality of packaging sealing. The maximum packaging capacity of the automated vacuum packaging mechanism is tested with two kinds of packaging bags under the requirement of stead sealing quality. As found, sealing failure occurs when the maximum packaging capacity 8-layer tray is exceeded. Diagnostic analysis is investigated to search for the cause-and-effect. The developed packaging machine is fit for the use of width of the bag mouth in the range of 260~300mm and has an operating capacity of 20 boxes per hour. Such an automated packaging machine can reduce the vacuum leakage of the packaging bag caused by man-made unstable operation, and improve the packaging capacity.