採用分散式可組裝陣列之電容感測晶片設計

Design of Capacitive Sensing Chip with Distributed Scalable Array Scheme

林俊宏(Chin-Hung Lin)

指導教授 ： 許孟烈

國立暨南國際大學/科技學院/電機工程學系/碩士(2021年)

https://doi.org/10.6837/ncnu202100056

摘要

近年來，由於機械手臂的普及化，在機械手臂上應用觸覺感測的需求逐年增加，最常被使用的方式為電容式觸覺感測，而電容式觸覺感測通常受到感測器面積大小與訊號導線長度而有使所限制。

本論文提出一種含有四個感測器的分散式可組裝陣列之電容感測晶片設計，並以電路板作為感測極板，形成一分散式可組裝之陣列，並將感測器、類比至數位轉換器與暫存器整合於晶片中。其中晶片使用到八位元逐漸趨近式類比至數位轉換器，為符合感測器之輸入範圍為0~1.8V，供應電壓為1.8V，工作頻率為5MHz，取樣率為500kS/s，輸入頻率為11.71875kHz時，ENOB為7.956 bits 功耗為58.2145μW。

本論文採用TSMC 0.18um 1P6M CMOS標準製程實現一個2x2陣列的電容式觸覺感測晶片，整體面積為651.311um × 532.6um，工作電壓為1.8V，操作頻率為5MHz，外接感測電容範圍為1pF~10pF，平均功耗為1.1196mW。

關鍵字

觸覺感測 ； 類比至數位轉換器 ； 分散式可組裝陣列

並列摘要

In recent years, due to popularity of robotic arm, the demand for applying tactile sensing on robotic arms is increasing year by year. The most commonly used method is capacitive tactile sensing. However, capacitive tactile sensing is usually limited by the size of the sensor area and the length of the signal wire. This paper proposes a capacitive sensor chip design of a distributed scalable array containing four sensors. The printed circuit board (PCB) is used as the sensing plate to form a distributed scalable array, and integrate the sensor, analog-to-digital converter and register in the chip. The chip uses an 8-bit successive approximation analog-to-digital converter with an input range of 0~1.8V, supply voltage of 1.8V, operating frequency of 5MHz, and sampling rate of 500kS/s. When the input frequency is 11.71875kHz, the ADC achieves an ENOB of 7.956 bits and the power consumption is 58.2145μW.
A tactile sensing chip with 2x2 sensor array is implemented in TSMC 0.18μm 1P6M standard CMOS process. The chip area is 651.311um × 532.6um, works at 1.8V power supply, and operates at 5MHz. The external induced capacitance to be sensed ranges from 1 to 10pF, and the average power consumption is 1.1196mW.

並列關鍵字

Tactile Sensor ； Analog-to-Digital Converters ； Distributed Scalable Array

參考文獻

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