研製具矽支架之發光二極體與其特性分析

Fabrication of LED with Si Leadframe and Its Characterisitics Analysis

呂懷恩(Huai-En Lu)

指導教授 ： 蘇炎坤

崑山科技大學/工程學院/電機工程研究所/碩士(2010年)

摘要

發光二極體 ( Light Emitting Diode, LED ) 為廿世紀最偉大的發明之一，欲使發光二極體縮短取代傳統照明光源時程，須大幅提升輸出亮度，以及提高散熱特性。本論文提出一種體積微小化、可靠度提高、降低成本、減少熱聚集的封裝方法：晶圓級封裝之LED ( Wafer Level Package LED )。Wafer經蝕刻，製作與SMD LED相同的碗杯形狀，蝕刻後Si Level-Frame碗杯角度可比SMD LED大5度角、蝕刻速率1μm/min。接著晶圓經薄膜沉積，沉積Ti/Ag，Ti是增加膜與膜之間的接合度、Ag則是能將90%以上的光反射，其主要目的是增加光取出率，接下來進行元件封裝，晶圓級封裝完成後可與SMD LED成品相同，可將可靠度提高、降低成本、提高散熱特性。因為一般商業用的支架都是塑膠材料將金屬包覆在裡面，所以導致熱不易散出，塑膠材料的導熱係數約為0.2~0.8 W/m．k，然而晶圓級封裝可以有效的將熱經由silicon材料本身導出，Si的導熱係數約為140~150 W/m．k，經實際量測溫度可較目前封裝產品減少溫度3℃以上。

關鍵字

晶圓級封裝 ； 矽支架 ； 發光二極體 ； 散熱

並列摘要

Light Emitting Diodes (LEDs) is one of great inventions in 20th. To make LEDs substitution for tradition lighting sources today, the luminance of LEDs should be improved significantly, especially the promotion the Thermal diffusion of LEDs.
In this thesis provide a way of Wafer Level Package LED with volume small, high dependant, low cost and high heat dissipation. First, the wafer has the same bowl in shape with SMD LED by etching. Second, the wafer is made of film precipitation and the purpose is increasing reflection and thermal conductivity. Finally, the device progress to package. The Wafer Level Package LED’s products as the same as SMD LED. It is has high dependant, low cost and high heat dissipation. In general, the commercial level-frame is made of plastic and metal wrapped in plastic. So the heat is hard to disperse.
The material of plastic – the thermal conductivity is about 0.2 ~ 0.8 W/m•k but the Wafer Level Package LED is effective to disperse the heat by the material of silicon. The silicon conductivity is about 140 ~ 150 W/m•k. In nowadays, the temperature of package product can reduce 3℃ by mensuration.

並列關鍵字

Wafer Level Package ； Silicon Lead-Frame ； LED ； Thermal diffusion

參考文獻

[2]Cree , “Solid State Lighting Revolution”, January 2010 Jovani Torres

[3]S. Nakamura,”Superbright Green InGaN Single Quantum Well Struture Light-Emitting Diodes,” Jpn.J.Appl.Phys, vol.34, pp. L1332-L135, 1995.

[8]劉育昇, “碩士論文” 私立崑山科技大學電子工程研究所

參考文獻

[1]林菀晴, “高亮度LED商機耀眼,” 電子技術226期, pp. 25-40