水冷式散熱器的分析及實驗

Analysis and experiment of the water-cooling radiator

李汪昌(Wang-Cheng Lee)

指導教授 ： 林水木 ； 何星輝

崑山科技大學/工程學院/機械工程研究所/碩士(2005年)

https://doi.org/10.6828/KSU.2005.00079

摘要

本論文主要是在探討超薄水冷式散熱器運用於筆記型電CPU之設計。這冷卻系統設計的原理是將水柱直接衝擊在CPU（熱源）處以達到高性能冷卻之效果。水流穿過放射狀的鰭片，在熱傳遞時，水和熱源之間的溫度差幾乎保持一定。利用STAR-CD 3D軟體分析相關參數對系統散熱的影響。根據分析，可得超薄水冷式散熱系統的最佳化設計。本文中除了數值模擬外，並作實驗印證數值分析之正確性。發現模擬和實驗結果非常一致。目前市面上關於散熱方面的元件，如熱管－散熱座－散熱風扇組件解熱量有限而熱傳遞量將近30 W，且其風扇噪音較大。而本文所分析的水冷式散熱器其尺寸約為直徑40mm和厚度少於10mm。當CPU溫度保持在60℃以下，水冷式散熱器其熱傳遞量在60W以上。而且，用一台小的幫浦替換嘈雜的風扇，噪音將被大大減少。

關鍵字

水冷式 ； 流場性能 ； 散熱座

並列摘要

In this paper, an ultra-thin water-cooling radiator for cooling the CPU of a notebook is designed. This principle of the cooling system design is to impinge water jet directly on the CPU (heat source) for high performance cooling. The water flows radially through the fins. In proceeding of heat transfer, the temperature difference between the water and the heat source is kept even. The STAR-CD 3D software is used to analyze the influence of parameters on the heat transfer of the system. Based on the analysis, one can get the optimum design of cooling radiator. Beside the numerical simulation, an experiment is made to verify the numerical results. It is found that the numerical and experimental results are very
consistent. The heat transfer of the commercial cooling equipment such as the heat pipe- sink-fan unit used in the notebook is almost 30 W. Moreover, the fan is associated with a noise. The size of the proposed water-cooling radiator is about less than 40 mm in diameter and less than 10 mm in thickness. The heat transfer of the water-cooling radiator is more than 60W while maintaining the CPU temperature at less than 60℃. Moreover, replacing the noisy fan by a small pump, the noise will be greatly decreased.

並列關鍵字

Flow Field ； Water Cooling ； Heat Sink

參考文獻

4. Tunc , G. , Bayazitoglu , Y., “Heat Transfer in Rectangular Micro-channels,”International Journal of Heat and Mass Transfer, No.45,pp. 765-773, June, 2002.

6. Sami A.S. , “A Numerical Study of the Flow and Heat-Transfer haracteristics of an Impinging Laminar Slot-Jet Includeing Cross-flow Effects”, Int. J. Heat Mass Transfer, Vol. 35, No.10 ,1992,pp. 2501-2513.

7. Karim, O., Schaeffer, C., Mallet, B., Coyaud, M. and Gimet, E.,“Power Module Integrated Cooling Design Using CFD Simulation,”pp. 1925-1930, 2001.

8. Morrison, A. T., “Optimization of Heat Sink Fin Geometries for Heat Sink in Natural Convection,” Intersociety Conference on Thermal Phenomena , IEEE, 1992, pp. 145-148.

9. Ryu, J. H., Choi, D. H. and Kim, S. J., “Numerical Optimization of the Thermal Performance of a Microchannel Heat Sink,” International Journal of Heat and Mass Transfer, Vol. 45, pp.2823-2827, 2002.