超薄水冷式散熱器之分析及實驗

Analysis and experiment of the ultra-thin water-cooling radiator

劉憲鋒(Hsien-Feng Liu)

指導教授 ： 林水木

崑山科技大學/工程學院/機械工程研究所/碩士(2006年)

https://doi.org/10.6828/KSU.2006.00057

摘要

本論文主要是在探討超薄水冷式散熱器運用於筆記型電腦CPU之設計。這冷卻系統設計的原理是將水柱直接衝擊在CPU（熱源）處以達到高性能冷卻之效果。水流穿過放射狀的鰭片，在熱傳遞時，水和熱源之間的溫度差幾乎保持一定。利用STAR-CD 3D軟體分析相關參數對系統散熱的影響。根據分析，可得超薄水冷式散熱系統的最佳化設計。而本文所分析的水冷式散熱器其尺寸約為直徑40mm和厚度少於10mm。當CPU溫度保持在70℃以下，水冷式散熱器其熱傳遞量在60W以上。而且，用一台小的幫浦替換嘈雜的風扇，噪音將被大大減少。

關鍵字

散熱座 ； 經驗公式 ； 流場性能 ； 水冷式

並列摘要

In this paper, an ultra-thin water-cooling radiator for cooling the CPU of a notebook is designed. This principle of the cooling system design is to impinge water jet directly on the CPU (heat source) for high performance cooling. The water flows radially through the fins. In proceeding of heat transfer, the temperature difference between the water and the heat source is kept even. The STAR-CD 3D software is used to analyze the influence of parameters on the heat transfer of the system. Based on the analysis, one can get the optimum design of cooling radiator. The size of the proposed water-cooling radiator is about less than 40 mm in diameter and less than 10 mm in thickness. The heat transfer of the water-cooling radiator is more than 60W while maintaining the CPU temperature at less than 70℃. Moreover, replacing the noisy fan by a small pump, the noise will be greatly decreased.

並列關鍵字

Empirical ； Flow Field ； Water Cooling ； Heat Sink

參考文獻

27.李汪昌，「水冷式散熱器的分析及實驗」，崑山科技大學機械工程研究所碩士，2005年。

1.Qu, W., Mudawar, I., “Experimental and Numerical Study of Pressure Drop and Heat Transfer in a Single Phase Micro Channel Heat Sink,” International Journal of Heat and Mass Transfer, Vol. 45, pp. 2549-2565, 2002.

2.Lytle D., Webb B. W. “Air jet impingement heat transfer at low nozzle plate spacing” , Int. J. Heat Mass Transfer , Vol. 37 , No. 12 , 1994, pp. 1687-1697.

3.Karim, O. Crebier, J. C., Gillot, C. Schaeffer, C. Maller, B. and Gimet, E., “Heat Transfer Coefficient for Water Cooled Heat Sink : Application for Standard Power Modules Cooling at High Temperature,” pp. 1938-1943, 2001.

4.Dickinson, R., Novotny S., Vogel, M. and Dunn, J., “A System Design Approach to Liquid Cooled Microprocessors,” Inter Society Conf- erence on Thermal Phenomena, pp. 413-420, 2002.