微探針是一種用來量測物體特性的元件,廣泛的應用在製造業,例如:表面粗糙度量測、電性量測、積體電路良率測試等。微鎢探針的加工技術有放電加工( Electrical Discharge Machining,EDM )、電解加工( Electrochemical Machining,ECM )、研削加工( Grinding Machining )等方法,各種方法都有著明顯的優缺點,如利用電解製程製作微鎢探針,加工時間長,且尺寸誤差大,而使用機械研磨可快速將微鎢探針成形,但表面粗糙度不佳。因此本研究利用機械研磨方法快速研磨出微鎢探針的雛形,接著利用電解加工方式將微鎢探針表面整平,且同時將原本的探針平頭電解成圓頭狀,探討在不同電解參數下所生產的探針特性。 藉由實驗證實利用研磨加工與電解加工複合而成的新製程能有效降低加工時間,在單次加工單支微鎢探針時,研磨複合電解製程加工時間僅需110秒,較純研磨製程的210秒縮短了48 %的加工時間,更比電解製程所需的1800秒少了94 %的加工時間,且表面粗糙度較純研磨製作的微鎢探針低,並且在相同針測力量下使用新製程所生產出的微鎢探針可以得到比純研磨加工方法及市售微鎢探針還要低的接觸電阻。 關鍵詞:研磨、電解、微鎢探針、接觸電阻
Microprobes are a component which can be used to measure the features of objects. It was applied to manufacturing widely. For example, it can be used to measure surface roughness, electricity, integrated circuit yield and so on. There are different kinds of tungsten microprobe machine technologies. They are Electrical Discharge Machining (EDM), Electrochemical Machining (ECM), Grinding Machining, etc. However, each of them has their own obvious advantages and disadvantages. The disadvantages of producing tungsten microprobes by electrolytic machines are long waiting time and inaccuracies. Otherwise, using grinding machines can form tungsten microprobes quickly, but it lowers the quality of surface roughness. Therefore, in this research, the researcher employs several methods to manufacture the tungsten microprobe, and then discuss about the probe features which was produced under the different electrolysis parameters. First, the researcher grinded the model of tungsten microprobe rapidly by mechanical grinding method; afterwards, leveled the surface of the tungsten microprobe by electrochemical machining, while also electrolyzing the original flat head of probe into a round head. The experiment attests that the new process of combining grinding machines and electrolytic machines can efficiently reduce machining time. For each product of one tungsten microprobe, machining time of grinding hybrid electrolysis process is only 110 seconds. Compared with pure grinding process, which takes 210 seconds, the time is reduced by 48%. Moreover, it reduces the time of electrolysis process by 94%, which takes 1800 seconds. Also, its surface roughness degree is better than the tungsten microprobe produced by pure grinding process. Using the new process to produce the tungsten microprobe can get less contact resistance under the same probing force, than even the ones produced by pure grinding machining method or the commercial ones. Keywords: grinding, electrolysis, tungsten microprobe, contact resistance