銅線導入積體電路IC構裝之技術開發

本篇論文要探討的是IC半導體(Integrated circuits,IC)構裝，金線轉換銅線製程的技術延伸，探討材料轉換是否造成銲線作業上品質良率的差異，並且以實驗來證明製程轉換的可行性。本次研究的線材材料是使用銅線線徑20μm的線徑材料，在實驗測試過程中觀察製程轉換時金線與銅線製程的差異性，文中也有介紹銲線機作業原理及分析銲線作業動作概論，並且將參數導入銲線機進行相關的實驗測試。首先本次的實驗可以分成幾個重點觀察，第一為金線製程的參數導入銅線製程後與機台是否能順利運作，並且測試時是否能順利展開作業，作業過程中會造成什麼樣的材料物理變化，這些問題本次論文會有相關性質的研究說明，第二為觀察銅球銲黏在晶片(PAD)鋁墊的特性，並且利用電子顯微鏡觀察球型的變化，及導腳上的魚尾紋縫點的黏著性延展效果，第三為導出最佳的銲線作業參數完成後，確認觀察銅球球型、厚度大小、弧形高度與折角、及魚尾紋外觀上的缺陷檢查，並且針對銅球規格不良、魚尾紋銲黏效果不佳等異常情形，在排除設備異常後朝向參數做為修改。最後實驗結果中，利用銅球推力及縫點拉力所呈現出來的數據證明，銅線製程在銲線作業的可行性。

關鍵字

銅線製程、銲線作業、金球推力、縫點拉力、作業參數

並列摘要

This paper is to explore the structure of the semiconductor IC loaded, Gold copper process technology to convert extended Discussion material into whether caused by differences in the quality and yield of wire work,And with experiments to prove the feasibility of the conversion process. This study is the use of copper wire material Wire material 20μm in diameter,Observed the conversion process gold and copper manufacturing process differences in experimental testing,Introduction This paper also describes the operation principle and analysis bonders wire job action,Import parameters wire bonders and related laboratory tests. First, this experiment can be divided into several key observations,The first parameter gold manufacturing process after the import of copper manufacturing process and the machine is functioning smoothly,And whether it can successfully expand job test,Job process will cause any kind of material physical changes,These issues related to this paper will study the nature of the instructions,The second is to observe the characteristic copper ball bonding wafer stick aluminum pad,And the use of electron microscopy ball changes,And guide the feet wrinkles seam point adhesion effect extension,The third is exported after the completion of the best wire job parameters,Confirm copper balls observed defect type, thickness size, height and Angular arc, and crow's feet appearance inspection,And specifications for copper ball bad,crow's feet and other effects of poor welding sticky unusual circumstances,The exclusion device toward arguments for abnormal changes. Finally, experimental results,Use copper ball thrust and pulling force sewing point the presentation of data to prove that,Copper wire bonding process in feasibility work.

並列關鍵字

Keywords : Copper wire, wire-bond, ball share,wire pull, parameters

參考文獻

[19] FATC福懋科技股份有限公司

[8]1991 IEEE期刊，作者Ali SABOUI,SGS-THOMSON MICROELECTRONICS Corporate Package Development,Grenoble, FRANCE所刊載的WIRE BONDING LIMITATIONS FOR HIGH DENSITY FINE PITCH PLASTIC PACKAGES

[10]田中電子工業股份有限公司製品資訊http://www.tanaka-bondingwire.com/traditionalChina/03-4bw.html

[12]Breach, C. D.; Wulff, F. New observations on intermetallic compound formation in gold ball bonds: General growth patterns and identification of two forms of Au4Al. Microelectronics Reliability. 2004, 44 (6): 973. doi:10.1016/j.microrel.2004.02.013

[14]國立虎尾科技大學光電工程系光電與材料科技陳柏宇碩士論文2014年6月-LED 封裝中合金線材之銲線參數對接線信賴度影響之研究

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銅線導入積體電路IC構裝之技術開發

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