晶圓級封裝壓合系統之研究開發

Design and Development of a Wafer Level Package (WLP) Bonding System

范志文(Jerry Fan)

國立虎尾科技大學/電機資訊學院/光電與材料科技研究所/碩士(2007年)

摘要

隨著半導體製程技術能力不斷向上提升，半導體晶片的功能日益強大，以致於半導體晶片訊號的傳輸量逐漸增加，晶片的連接腳數亦隨之增加，傳統的封裝形式如表面黏著(surface mount technology)與錫球陣列(ball grid array)已逐漸無法滿足市場的需求，八吋晶圓級封裝技術逐漸成為新技術主流。
晶圓級封裝壓合系統，為目前晶圓級封裝業極為重要的生產設備,因製造及研發技術的層次較高,故國內所需皆仰賴進口，目前國內尚無相關研究及生產，但以目前半導體構裝工業發展趨勢看來，國內勢必要掌握相關機械設計及生產技術,故本研究經由系統規劃與理論分析加上與封裝廠實際討論後，運用真空、機械、壓力、溫度控制等技術進行整合設計，並經組裝、調機、測試,完成一套晶圓級封裝壓合系統，同時將傳統模具壓合機構改良並能符合真空系統使用需求，目前此系統最大可壓合八吋晶圓，壓力均勻性可控制在 ?4.6%以下，溫度均勻性可達 ?2.7%以下，符合量產機台之規格。

並列摘要

With the evolution of the semiconductor fabrication technology, there have been several basic shifts in electronic packaging over the last few decades. The surface-mount technology and ball-grid-array packages were two important steps for high-throughput assembly of a wide variety of integrated circuits (ICs), while reducing the pad pitch on the printed circuit board. Recently, the wafer-level packaging (WLP) uses the technology of IC packaging at a wafer level, instead of the traditional assembly process of each individual unit after wafer dicing.
The wafer bonding system is an extremely important production equipment for the WLP process. Up to now, most of the WLP bonder are manufactured from the US or Japan companies. There are very few domestic researches or design experiences about this topic. In this thesis, a systematic design and analysis of the WLP bonding system was made based on the customer specification. By integration of the vacuum, mechanics, pressure and temperature control techniques, an 8-inch WLP bonding system was fabricated. In particular, the conventional molding mechanics is modified and can be operated in the vacuum system. The pressure uniformity can control within ?4.6% and the temperature uniformity can reach ?2.7%. The yield performance has matched the specification of the mass production equipment.

參考文獻

〔1〕 謝新協，“表面黏著型發光二極體取放機構之研製”， 私立中原大學，機械研究所，碩士論文，91年12月

〔7〕 A, Roth, “Vacuum Technology,” New York:Elsevier Science Pub, 1990

〔13〕 INFICON, “Operating Manual,” Declaration of Conformity, 08-2004

〔14〕 Shimazdu, “Turbo Molecular Pump Instruction Manual,” Shimazdu, 2005

〔15〕 MDC, “Vacuum Products Corporation,” MDC, 2004