本研究利用射頻磁控共濺鍍系統,以氧化鋅以及氮化鋁為共濺鍍靶材,藉由改變施加在氧化鋅及氮化鋁靶材之射頻功率,製作並控制具有不同濃度的鋁+氮共摻雜之氧化鋅薄膜,並在氮氣環境下進行後續熱處理製程,藉以活化摻雜在薄膜中的受體離子,製作p型氧化鋅薄膜。 研究結果顯示,在室溫下所沉積之具有不同鋁原子濃度之共濺鍍薄膜呈現n型的導電型態,且薄膜的電子濃度隨著鋁原子濃度的上升而上升,當鋁原子理論值含量[Al/(Zn+Al)]為60%,薄膜的載子濃度則有明顯下降的趨勢。而根據共濺鍍薄膜的結晶特性量測結果,可以發現,薄膜之結晶性從未摻雜氧化鋅薄膜的C軸ZnO(002)優選成長方向逐漸轉變為以ZnO (001)成長方向為主。當共濺鍍鋁原子含量達60%時,此時薄膜受到大量氮化鋁共濺鍍的影響,形成非晶的結構特性,進而大幅劣化薄膜的電特性。為了有效活化鋁+氮共摻雜氧化鋅薄膜中的受體離子,獲得p型氧化鋅薄膜,本研究針對於室溫環境下鋁原子摻雜濃度之理論值為10%的共濺鍍薄膜,藉由適當溫度的熱處理製程,可以使薄膜的電特性轉變為p型的導電型態,從x光繞射光譜圖可以發現,薄膜中有氮化鋅的結晶相產生,顯示此時薄膜中的鋅原子有氮化(nitrification)的現象,此外,根據光激發螢光譜圖及x光光電子能譜圖的量測結果也可以發現,熱處理製程可以有效的活化共濺鍍薄膜中的氮離子形成N-Zn化學鍵結,使得薄膜呈現p型的氧化鋅導電型態,而當熱處理條件為400oC、氮氣環境熱處理30分鐘,此時鋁+氮共摻雜氧化鋅薄膜具有優異的p型導電特性
Al-N codoped zinc oxide films were prepared using a radio-frequency magnetron cosputtering system using AlN and ZnO targets at room temperature. The as-deposited cosputtered films at various theoretical atomic ratios [Al / (Al + Zn) at.%] showed n-type conductive behavior in spite of the N atoms exceeding that of the Al dopants, indicating that the N-related acceptors were still inactive. The crystalline structure was obviously correlated with the cosputtered AlN contents and eventually evolved into an amorphous structure for the Al-N codoped ZnO film at a theoretical Al doping level reaching 60%. With an adequate post-annealing treatment, the N-related acceptors were effectively activated and the p-type ZnO conductive behavior achieved. The appearance of the Zn3N2 phase in the X-ray diffraction pattern of the annealed Al-N codoped ZnO film provided evidence of N impurity activation. The red-shift of the shallow level transition and the apparent suppression of the oxygen-related deep level emission investigated from the PL spectrum measured at room temperature were concluded to be influenced by these activated N-related acceptors. In addition, the activation of the N acceptors denoted as N-Zn bond and the chemical bond related to the Zn3N2 crystalline structure were also observed from the associated XPS spectra.