電子束蒸鍍系統蒸鍍參數之研究

Research for parameters of E-beam evaporator system

曾泓嘉(Hung-Chin Tseng)

國立虎尾科技大學/電機資訊學院/光電與材料科技研究所/碩士(2008年)

摘要

光電與半導體產業在台灣發展蓬勃快速，且電子束蒸鍍系統已被廣泛應用於相關產業，目前已經成為台灣新興電子高科技工業的主要之應用設備，奠定了電子束蒸鍍系統的必要性，其產業對於產量的需求大量增加，製程發展技術日益精進，蒸鍍速率上的要求越來越高，為了配合產業需求提升，已一再發展出更高能量之電源供應器，但並無相關文獻針對其同樣能量之最大利用率作做目標改善。
本論文針對電子束蒸鍍系統，作為研究並改善蒸鍍速率之最佳參數，利用不同廠牌之蒸鍍源應用於金屬材料(鋁)與氧化物材料(氧化銦錫)做綜合比較，研究製程薄膜與製程參數之關係，實際由製程中尋找出最適當之條件並由系統裝置中比較出電子束掃瞄方式對蒸鍍速率，膜厚及鍍膜均勻性之關係研究。
經實驗研究分析出三種不同廠牌所設計出電子槍形式運用在金屬與氧化物之最佳參數。在蒸鍍金屬時電流與鍍率成正比關係產生最大電流範圍在930mA~860mA產生其蒸鍍速率座落在28~20.5 Å/SEC區間。在蒸鍍非金屬時維持鍍率穩定性為此實驗首要步驟以達到靶材最高利用率之經濟價值，以固定鍍率維持穩定度在80%以上。

並列摘要

Photonic and semiconductor industry are grown up flourishing in Taiwan, and E-beam evaporator has been used generally in all of relative field. Now, it become major equipment in Taiwan sunrise and high technology industry, and establishes its necessity there. Due to the industry requesting and requirement of process, throughput and deposition rate become more and more important in the future in order to match this issue, the higher power supply has been made for marketing requirement. But, there has no paper or document studying for maximum utility rate in the same capacity.

The paper will focus on evaporator system for optimized parameter of deposition rate improving. We will use different brand of e-gun system in comprehensive analysis of metal (Al) and TCO (ITO) deposition, study the relativity of process deposition and parameter. And programmable sweep method and variable of crucible cooling water temperature also will be observed in this experiment. Looking for an optimized process condition, and make a comparison between the E-beam sweep methods.

After experiment researching, we got the optimized parameter of metal and oxide evaporation application in three different brand of evaporator. In metal deposition, current and deposition is direct proportion. Beside that, Max. Current generation is between 930mA to 860mA, and deposition rate is from 28 to 20.5 Å/SEC. The experiment, first priority, is deposition rate stability keeping while making nonmetal film in order to reach the purpose of increasing target utilizing rate and keep the deposition rate upon 80%.

參考文獻

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