記憶體模組製造業因代工廠不斷增加,使得多數工廠處於惡性削價的競爭環境中,如何提升公司的競爭力,已經是公司永續生存的重要課題。提升競爭力的指標之一即是提高製程效率。在記憶體模組製程中,表面黏著技術(SMT)機台運作的高效率是減少成本支出的關鍵,因此設法避免SMT機台發生異常便成為記憶體模組製造廠首要工作之一。 有鑑於此,SMT製程導入失效模式分析,依據客戶要求之事項,改善製程中的管制項目,進而滿足符合客戶需求。在FMEA失效模式分析中不管風險優先數是否超過70,如客戶有提出要求一定要進行管制。進行FMEA必須使用品質改善工具如魚骨圖、品質機能展開圖找出影響產品之品質因素。並討論現行規範是否能有效發現異常現象,再訂出難檢度。經過小組的腦力激盪找出適當改善措施,且所有改善方式必須標準化。FMEA導入最重要原因為期待產品在設計階段就能它把做好,為公司節省成本提升公司競爭力且降低生產中產生的失敗成本。
Because of the increase in the number of OEM manufacturers, most of the DRAM manufacturing companies are facing the trend of aggressive price competition in the industry. How to increase competitiveness in order to enhance company’s sustainability has become a very important topic. One way to increase competitiveness is to improve manufacturing efficiency. In the DRAM manufacturing process, high efficiency of the Surface Mount Technology (SMT) machines is the key element to reduce DRAM manufacturing cost. Therefore, keeping SMT machines in good working condition has become one of the major tasks for a DRAM manufacturing company. The purpose of this study is to apply the Failure Mode and Effects Analysis (FMEA) technique to analyze the abnormality of the SMT production process and recommend precautionary measures that can reduce the risk of production failure.