雷射與熱壓條件對微熱壓成形中高分子高階結構之影響

Effect of laser and embossing condition on the superstructure of micro-embossing molded product of polymer

張亞平(Ya-Ping Chang)

指導教授 ： 陳仁浩

國立交通大學/工學院/機械工程系所/碩士(2009年)

https://doi.org/10.6842/NCTU.2009.00048

摘要

高分子材料的高階結構在加工期間會隨著不同的加工履歷造成不同的影響，一般熱壓成形之控制參數有溫度與壓力等，而在製作功能性材料方面略顯不足。近年來的研究顯示成形中添加能量場來對高分子高階結構產生影響，可以產生不同的高次構造，因此外加能量場對於功能性材料來說格外重要。
本研究觀察不同熱壓條件以及雷射光的照射在熱壓成形中對高分子材料的高次結構影響，由實驗結果發現熱壓成形品內部雖然沒有明顯的剪切力作用，但仍然會分成三層不同的構造，大致上類似射出成形品的表皮層、中間層以及核心層，各層的厚度比約為1：1.2：13.6，並且在熱壓壓力以及冷卻速度的改變下，會使得高分子材料內的各層構造有所改變。在高溫、冷卻速度慢的環境下，雷射光照射材料會使得材料照射處收縮率降低、以及結晶度下降。

關鍵字

雷射 ； 熱壓 ； 高次構造 ； 微結構

並列摘要

The superstructure of the polymer materials will be different with different process. The hot embossing mold usually use pressure and temperature to control, but this is not enough to produce the functional materials. In recent years, the researches show that added energy field on the structure of polymer materials in forming stage,it had changed the material property. We can use it to manufacture the different superstructure, so the effect of the extra energy field is very important for the functional materials.
In this study, we observed the effect of laser and hot embossing condition on the superstructure of micro-embossing molded product of polymer. In the result of the experiment, we can find that the inside of the product will be divided into three layers without shear force. Three layers are formed from the lateral surface to the interior: the surface layer, the middle layer, and the core layer. The proportion of each thickness of these three types of layers in a cross section is about 1:1.2:13.6. The superstructure of the layers would be changed with changing embossing pressure and cooling rate. In high temperature and slow cooling rate, the materials shrinkage of the irradiated department and the degree of crystallization would be decreased by laser beam irradiation.

並列關鍵字

Laser ； Hot Embossing ； Superstructure ； micro structure

參考文獻

[1] S. Fatikow and U. Rembold, ‘‘Microsystem Technology and Microrobotics’’, Sprigner, pp. 1-5, 1997.

[2] E. W. Becher, W. Ehrfeld, P. Hagmann, A. Maner and D.Muchmeyer, ‘‘Fabrication of microstructures with high aspect ratio and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding(LIGA process)’’,Microelectronic Engineering, Vol.4, pp. 33-56, 1986.

[3] O. Rotting, W. Bacher, and K. D. Muller, ‘‘Polymer microfabrication technologies’’, Microsystem Technology, Vol. 8, pp. 32-36, 2002.

[6] M. Heckele, W. Bacher, K.D. Muller, ‘‘Hot embossing-the molding technique for plastic microstructures”, Microsystem Technologies, Vol. 4, pp. 122-127, 1998.

[7] Y.D. Wang and M. Cakmak, ‘‘Development of structure hierarchy in injection-molded PVDF and PVDF/PMMA blends Part III. Spatial variation of structure as detected by small-angle light scattering’’, Polymer, Vol. 42, pp. 3731-3743, 2001.