十二吋晶圓廠自動化搬運系統規劃與導入—以A公司為例

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楊昌修(Chang-hsiu Yang)

指導教授 ： 何應欽

國立中央大學/管理學院/工業管理研究所碩士在職專班/碩士(2008年)

摘要

近年來在全球競爭逐漸白熱化之情況下，半導體廠為了提昇公司競爭力，無不全力增加十二吋晶圓廠的設立，藉以提高產量並降低生產成本。而自動化搬運系統的效率便成為其中最重要的一環。相較於八吋晶圓廠，十二吋的自動搬運系統，不論在軟體或硬體的規劃與設計，所考慮的因素都更為完整與詳細。
本研究將以規劃者之角度，針對十二吋搬運系統的規劃程序與模擬方法來探討如何才能規劃出一個高效能的自動化搬運系統。本研究更以實例來說明AutoMod這套模擬軟體在建構Interbay/Intrabay系統模型的過程，此外亦考量系統之控制邏輯等功能。
因本研究以個案研究的方式進行討論，尚無足夠證據作為廣泛性推論，但已能提供往後相關研究的研究參考；本研究在分析案例中的規劃程序時，並未考慮企業營運策略及財務與企業大小等問題。

關鍵字

十二吋晶圓廠自動化搬運系統

並列摘要

In recent years situation of the global competition is getting obvious and semiconductor factories in order to promote the company competitive abilities which increase twelve inches semiconductors established to enhance the output in order to reduce the production cost. However the automated transporting system efficiencies will become the most important link. Compares to eight inches with twelve inches automatic transporting system, the latter one no matter the software or the hardware which plan and the design are better than the former. And twelve inches semiconductors consider factors are also more details and complete.
This research will be the planer views, to conduct how to plan a high efficiency automated transporting system from scheming out the procedures and the methods of simulation. The example in this research showed the AutoMod this set of software which simulation constructing constructs of Interbay/Intrabay system model’s process, in addition also considers system functions and control logic.
This research carried on the discussion by the case study way, but not has enough proofs to be extensive inferences. However it also able to provide the research reference for the future studies. For this case study, analysis it planned procedures but did not consider business strategies、finances and the enterprise sizes.

並列關鍵字

300mm fab AMHS System Planning and Implementatio

參考文獻

1. Kaempf , U., “Automated Wafer Transport in the Wafer Fab“, Advanced

Semiconductor Manufacturing Using Large Facility Models”, Proceedings of

Winter Simulation Conference, 1999.

3. Weiss, M. “300 mm Tool Automation and its impact on Fab Design and OEE”,

IEEE/SEM Advanced Semiconductor Manufacturing Conference, 1996.