被動式微型幫浦之設計與製作

DESIGN AND FABRICATION OF THE PASSIVE MICROPUMP

李穎松(Ying-Sung lee)

指導教授 ： 簡昭珩

大同大學/工程學院/機械工程學系所/碩士(2006年)

摘要

微幫浦系統主要功能是獲得微小流量的精準控制，本文所製作的微幫浦屬於無閥式壓電微幫浦，是利用擴散口∕噴嘴結構來取代傳統懸臂樑式的閥門結構，避免因懸臂樑的疲乏所造成的誤差。利用壓電片來驅動薄膜作為流體驅動源。在製作過程中利用電鍍銅方式將母模製作出來，使用熱壓成形方式製作微型幫浦結構，最後使用熱壓接合方式完成封裝。
本篇主要針對熱壓接合部份做詳細探討，以往熱壓接合部分尚無利用壓克力薄膜方式進行接合，多採用黏著或是鎖住固定，主要再於壓克力薄膜熱壓接合不易，會有變形與密合的問題產生，熱壓接合的優點為在製作上可避免黏著方式的黏膠阻塞流道及鎖住方式易於滲漏的缺點。實驗測試結果在110℃的條件下接合15分鐘，接合效果最佳。
成功的完成為幫浦的製作後，在實作量測時，觀察到在頻率25Hz、電壓90V時，有本實驗最大流率7.26μl/min。初步確定所建立的微幫浦結構的正確性與可用性，在成本上面也大為降低，以利將來設計更佳的微幫浦及應用。

關鍵字

微型幫浦

並列摘要

In this study, the valveless piezoelectric micropump with nozzle and diffuser structures is to replace the micropump with traditional cantilever bean, and could avoid the efficient decreased from cantilever bean fatigue. In the fabrication process, the electroplate technology is applied to fabricate mold, and hot embossing technology is provided to produced the structure of micropump.
In hot embossing process, PMMA material is used as the thin film structure. In the past, micropumps always stick or chain up the structure of pump and thin film. Because of PMMA material is difficult to bond. The advantage of hot embossing could avoid defects occurred in channel and the seepage occur in the stick and chain up bonding. The experimental parameter of hot embossing on the micropump was bonding 15min at the 110℃.
The maximum experimental flow rate of driving water, with dc voltage 90V at 25Hz, was 7.26μl /min.

並列關鍵字

MICROPUMP

參考文獻

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