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用於雷射微細加工軟性電路板之氣體控制分析

Gas Control Analysis for Laser Micromachining on Flexible Print Circuit Board

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摘要


本研究針對雷射微細加工軟性電路板的電路成形系統,相關的各式正負壓氣體流量控制作分析探討,其中包括吹塵、集塵、冷卻、遮蔽、及吸附作用。傳統的正負壓氣體流量控制方式僅設計在於各式調壓閥進出氣體流量及壓力控制,由操作者依使用情形調整,因此大都為傳統氣壓迴路設計,並無製程技術包含於內而成為智能化控制。所以本研究將導入雷射微細加工製程技術與氣壓控制判別整合而成為智能化系統。一般雷射加工對於氣體需求僅於吸附材料,吹離塵粒及保護鏡片。但對於各種壓力與流量需求受限於操作人員之經驗來修正調整,對於基本原理研討,或是工程製程技術及由實驗測試來取得系統整理作依據,都缺乏系統化知識。因此本文針對雷射用於軟性基板上之厚膜電路作微細加工技術作研究,將各種氣壓需求整理及分配適當管徑控制規格,作出性能比較差異,從而取得分析數據來論證氣壓管控方式,節省氣源使用量及確保功能性,以及最佳化之製程氣壓參數。一般雷射加工對於氣體需求經由各種壓力與流量需求調整測試及操作人員之嚐試性修正來調整,可是對於基本原理研討,或是工程製程技術,缺乏系統化知識,但經由本實驗測試來取得壓力與流量需求參考數據,將各種氣壓需求整理及分配適當管徑控制規格,作出性能比較差異,從而取得分析數據來論證氣壓管控方式,節省氣源使用量及確保功能性,以及最佳化之製程氣壓參數。目前本研究整合製程的氣壓控制相關參數及公式計算,並將計算後之數值先行使用手動方式調整氣壓迴路相關元件,做為本文之主要研究方向,而未來將持續發展成人機介面回授自動智能化而能作為氣壓及流量調整的控制和分析。

關鍵字

雷射 微細加工 氣壓控制

並列摘要


This study is focused on the analysis of air flow controlling solution for the laser micromachining, including particles removing, particle collection, cooling, masking, and adsorption function. Most of the air flow pressure controlling process is used by manual adjusting valve and reaching the desired results. So the target of this study, to combine the intelligent system with air flow with pressure rules to resolve laser micromachining processing technology. For general laser applications, the air flow with pressure controlling is focused on particles removing, samples absorption devices, and lens protectors. the quality of the tuning process, it is limited by operator experiences, without logic knowledge or from experience-testing analysis. So this paper is focused on laser micromachining system which applied on thick film circuit patterning, it is verified the controlling solution based on data analysis, saving air, to make sure the functions and optimal processing for air flow with pressure controlling. By calculating the rules or theory of air flow with pressure, the air flow could be controlled by using human-machine-interface (HMI), the target of this study is focused on the manual adjusting by hand on air tube controlling devices. In the future, it could be integrated with HMI for auto feedback to control the air flow with pressure.

並列關鍵字

Laser micromachining gas control

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