- 學位論文
全濕式無電鍍銅金屬化於直通矽穿孔之完全填充展示
Demonstration of All-wet Electroless Copper-Metallization for Complete Filling of Though Silicon Vias (TSVs)
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- 鄭郁勳（2015）。自組裝單層衍生全程濕式銅金屬化在直通矽穿孔之應用〔碩士論文，逢甲大學〕。華藝線上圖書館。https://doi.org/10.6341/fcu.M0225663
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