殘氣之多變量分析在濺鍍製程監控的應用

Health Monitoring of a Sputter Process using Multivariate Statistical Analysis of Residual Gas Compositions

張菀真(Wan-Chen Chang)

指導教授 ： 汪上曉

國立清華大學/工學院/化學工程學系/碩士(2010年)

https://doi.org/10.6843/NTHU.2010.00181

摘要

LCD has been the most developing industry in Taiwan in the latest decades and is facing not only quality and cost problem when production increase and enlargement of panel size but also the fierce competitions come from other countries. Array process in LCD manufacturing is similar to semiconductor manufacturing process, where multivariable analysis has been applied on the monitoring and fault detection and has numbers of successful cases regarding process diagnosis and control.
Splash is fine melt particles formed in the sputtering process which reduce quality of products. And more than one factor lead to this defect. Analysis of residual gas is used to attribute the root factor of splash. First, it is necessary to decrease the dimensions of such a considerable dataset in batch process. Variables are chosen based on operation recipe or the physical meaning and separated to mean part, time scaling and residual. Obvious decay trends are discovered in time scaling, which is also regards as an important factor causing splash. A key residual gas V13 largely increases after preventive maintenance (PM) of equipment and lead to splash. Moreover, when V13 is back to a stable state, other two residual gases with high value are found leading to a high probability of splash. Besides, a multivariable analysis is applied on the residuals to examine that no incorrect operation causes splash.

關鍵字

濺鍍製程 ； 製程管理 ； 液晶顯示面板製程

並列摘要

無資料

並列關鍵字

sputtering ； process control ； LCD process

參考文獻

5. Sachs, E., Hub, A. and Ingolfsson A., “Run by run process control: combining SPC and feedback control. “ IEEE Transactions on Semiconductor Manufacturing, 8, 26-43 (1995)

10. Nomikos, P. and MacGregor, J. F. (1995) “Multivariate SPC Chart for Monitoring Batch Processes,” Technometrics, 37,41-59

11. Akima, H., “A New Method of Interpolation and Smooth Curve Fitting Based on Local Procedures,” Journal of Quality Technology, Vol. 27, 99-108

1. http://www.auo.com.tw/auoDEV/technology.php?sec=tftProcess&ls=en (access data:2009/08/18)

2. (a) Edgar, T.F.; Butler, S.W.; Campbell, W.J.; Pfeiffer, C.; Bode, C.; Hwang, S.B.; Balakrishnan, K.S.; Hahn, J., "Automatic control in microelectronics manufacturing: practices, challenges, and possibilities" Automatica 2000 pp. 1567-1603 (b) Moyne, J., Run-to-Run Control in Semiconductor Manufacturing, CRC Press, Florida, (2001) (c) Castillo, E.D., Statistical Process Adjustment for Quality Control, John-Wiley and Sons, New York, (2002)