Copper Aluminum Nano Junction Normal Temperature Processes and Methods Applied to the LED High Heat Transfer Performance

Ming-Wen Wang ； Bo-An Gao ； Ding-Jun Lin ； Jun-Han Chen

《Smart Science》 2卷1期 (2014/03) Pp. 36-43

https://doi.org/10.6493/SmartSci.2014.173

並列摘要

High-power light-emitting diodes (LED) have extremely broad applications. However, with the job requirements of high-brightness and high color temperature from light-emitting diodes, it must be followed to enlarge the operating current, thus heating up more rapidly. If its heat dissipation problem cannot be effectively solved, operation will be prone to bring about color shift, and it may even considerably shorten its life. Moreover, application value will therefore be greatly reduced. So in order to enhance the high-power LED luminous brightness and life to cope with the future development needs of high-power LED components, it is necessary to replace the use of conductive silver paste to stick thermally conductive Cu slug fixing grain and lead frame heat dissipation aluminum sheet. This is done by directly bonding thermally conductive Cu slug with pure aluminum, the formation of highly efficient direct heat conduction cooling structure. Therefore the topic points at the crux of the LED heat dissipation difficulty, puts forward of copper and aluminum bonding technology in the ordinary temperature and pressure, method to effectively improve thermal conductivity performance between LED die bond Cu slug and joining aluminum cooling module. This will ultimately make the LED's operation and applications perfect.

並列關鍵字

Light-emitting diodes ； Heat transfer performance ； Direct bonding of copper and aluminum

參考文獻

C. Y. Hsu, “Patent Analysis and TRIZ Innovative Design for Dispersing Thermal Technology of LED,” Master's Dissertation, NTUST, Taipei, Taiwan (2008)

R. Viswanath, V. Wakharkar, A. Watwe, and V. Lebonheur, “Thermal performance Challenge from Silicon to Systems,” Intel Technology Journal Q3, 3, 1-16 (2000)

K. A. Moores, Y. K. Joshi, “High Performance Packaging Materials and Architectures for Improved Thermal Management of Power Electronics,” Future Circuits International, 7, 45-49 (2001)

T. Watanabe, H. Sorita, A. Sutoh, A. Yanagisawa, O. Ohashi, and S. Sato, “Eutectic bonding of Al pipe to Cu pipe,” Yosetsu Gakkai Ronbunshu, 16, 35-44 (1998)

W. Lehnert, N. D. Cuong, “Experimental and Mathematical Simulation of Microstructural Evolution During Hot Rolling of Al and Cu Material,” Journal of Materials Processing Technology, 60, 567-574 (1996)