無鹵軟板用接著劑製作與接著性質分析

The Analysis of the Halogen-free Adhesive System Used for Bonding Polyimide and Copper Foil in the Flexible Circuit Board

魏明德(Ming-Te We)

指導教授 ： 洪信國

元智大學/工程學院/化學工程與材料科學學系/碩士(2006年)

摘要

本研究主要在探討聚磷酸酯類阻燃劑於軟板接著劑的阻燃效果，同時研究接著劑硬化(Curing)後剝離強度、溢膠、耐焊錫性、耐折性和耐環境測試等物性的影響，並針對不足的物性加以改良。實驗證實以聚磷酸胺為阻燃劑僅需20phr即可使聚亞醯胺覆蓋膜達到阻燃標準(UL94 VTM-0)，以三聚氰胺聚磷酸為阻燃劑則可獲得更佳的耐熱性，加入矽烷偶合劑可提升接著劑配方的耐焊錫性和耐環境測試，調整CTBN橡膠最佳量可使接著劑配方達到最佳的耐折性。

關鍵字

接著劑 ； 軟性印刷電路板 ； 聚磷酸 ； 阻燃

並列摘要

The effects of the addition of polyphosphate derivatives and various modifiers on the adhesion properties of the adhesive system used in the Flexible Printing Circuit Board are studied. The peeling strength, resin flow, soldering resistance, folding resistance, and environmental durability of the modified adhesive bonding systems are tested by the industrial standard methods. It is obtained that the durability and the adhesion strength prepared from the modified adhesives are improved. The folding resistance of the adhesive system depends on the CTBN amount. The addition of 20 parts ammonium polyphosphate in the adhesive can fulfill the requirement of UL-94 class VTM-0. The thermal resistance of the adhesive can also be enhanced by adding melamine polyphosphate. Moreover, the soldering resistance and the environmental durability of the bonds can be significantly improved by adding silane coupling agent in the adhesive.

並列關鍵字

adhesive ； flexible printing circuit board ； polyphosphate ； durability ； flame retardance

參考文獻

【1】 A R Horrocks and D Price, Fire retardant materials, Woodhead Publishing Ltd (2001)

【2】 Per Ola Darnerud, Toxic effects of brominated flame retardants in man and in wildlife, Environment International 29, p.841– 853 (2003)

【8】 Edward M. Petrie, Handbook of Adhesives and Sealants, McGraw-Hill (2000)

【11】 Curt Augustsson, NM EPOXY HANDBOOK, 3rd edition, Nils Malmgren AB (2004)

【12】 Shinn-Gwo Hong, DSC and FTIR analysis of the curing behaviors of epoxy/DICY/solvent open systems, Thermochimica Acta 316, p.167-175 (1998)