本研究利用氣體電漿誘導進行高分子材料表面改質及殺菌處理,探討電漿操作參數對基材表面性質如潤濕性、阻氣性及印刷適性等特性之影響,進一步引用電漿進行表面殺菌作業的效果分析。 高分子包裝材料經電漿進行表面處理,可發現改質後對高分子包裝材料之潤濕性有顯著的效果,而且電漿提升基材潤濕性的效果並不隨時間消失,基材的氣體滲透率及表面印刷性也能藉此提升。進一步以FT-IR 及SEM 照片為改質高分子包裝材料的整體完整性提供確認。如能善用電漿的處理改質效果,將能針對高分子包裝材料之表面性質進行改質,擴展其應用性。 經由氧氣電漿進行表面殺菌處理,由實驗結果明顯的發現電漿在殺菌作業上的優勢。實驗結果可發現電漿操作功率加大及電漿殺菌時間加長皆能造成微生物殺滅量的相對增加,其中又以電漿殺菌時間對於殺菌效率的提昇更為顯著,加上證明電漿於熱敏感性物質殺菌上的適用性,顯現電漿有效的提供一可替換傳統高溫殺菌法的選擇,在性質上以低溫、快速、無殘留、適用性廣等優點,有別於傳統殺菌法的種種限制。
This research ran surface modification and sterilization by gas plasma and discussed substrate’s surface properties, such as wettability, barrier properties and printability and then analyses the result of plasma sterilization. We found plasma surface modification can develop polymer’s wettability significantly by treating polymer’s surface with plasma. The efficiency of polymer’s wettability by plasma wouldn’t disappear with time. The barrier properties and printability of polymer substrate could be improved by plasma treatment, too. Furthermore, we confirmed it was work in modifying polymer pack material by FT-IR and SEM. If we applied the plasma modification well, we could modify polymer pack material’s surface properties, and expand the application. However, we proceeded sterilization treatment by oxygen plasma, and we found that it had the advantage of using plasma on sterilization in our experiment results. From our experiment results, we could find that the plasma operation power is not the main point, nevertheless, increasing plasma exposure time could enhance microorganism mortality. It was also proved that it was suitable using plasma sterilization on thermo-impressibility material and show plasma give a good choice instead of conventional heat sterilization. Plasma sterilization had lots of advantages, such as lower temperature, fast, no survival, adaptation extensively, and differ from conventional sterilization which had lots of restrictions.