由客訴資料探討積層陶瓷電容器印刷製程的不良分析及良率改善研究

Defect Analysis and Yield Improvement Study for the Printing Process of Multi-layer Ceramic Capacitors Using Customer Complaint Data

許銘浩(Ming-Hao Hsu)

指導教授 ： 陳慧芬

中原大學/電機資訊學院/工業與系統工程研究所/碩士(2012年)

https://doi.org/10.6840/cycu201200746

摘要

各類電子商品在求新求變之際，尤其著重導入輕薄短小，與低耗能發展的趨勢。積層陶瓷電容器對更小的0201英吋元件的需求量大增，在縮小元件尺寸的同時卻又要有更高的電容量，造成在生產的良率較低，並且有較高的市場不良返品比率。對於不良模式之電量偏低是內電極層的收縮程度以及偏移量過大導致，關鍵影響作業為內電極油墨印刷製程。

本技術報告以W公司為例，探討MLCC 0201/X5R/0.1uF/6.3V產品的內電極油墨印刷製程參數設定問題，目的是提昇良率、降低生產成本與客訴頻率。評估製程參數時，所使用的績效指標有印刷均勻度與印刷圖形寬度之離標值兩個。在不購置新機具與提高成本的前提下，決定採用的實驗方法為2n實驗設計，利用失效分析與特性要因圖選定的重要因子為刮刀角度、刮刀硬度、內電極鎳膏、印刷網版，以及網間間距，經由專業製程工程單位針對每個因子設定高與低兩個不同之水準，藉由各因子與水準排出的生產參數實驗組合來進行實驗。

本技術報告利用統計軟體Minitab來進行25分析，找出顯著因子之印刷網版與網間間距的主效應顯著，且彼此之交互作用也是顯著的。最後再將分析後的實驗組合透過製程工程單位專業的判定，以較低成本以及生產成功率高為基礎下，選定一組印刷製程最佳生產參數條件。即刮刀角度為高水準之80°、刮刀硬度為高水準之65°、內電極鎳膏黏度為低水準之13000cps、印刷網版為高水準之640個，與網間間距為低水準之2mm，可以使印刷製程的電性篩退率(即不良率)由16%降至6%，進而使全體製程的良率提升10%，並且成本約降低每年NTD 4,248,000，達到製程改善與參數最佳化的實驗結果。

關鍵字

積層陶瓷電容器 ； 印刷製程 ； 實驗設計

並列摘要

Various types of electronic products focus on particular emphasis on the import compact size and low power consumption trend at the novelty change the occasion. The smaller 0201 inch components of Multilayer ceramic capacitor are under increasing demand. Low yield of production and high field return rate are occurred while reduce in size but have higher capacitance. Low power consumption of non-performing model is the degree of contraction of the inner electrode layer and offset excessive lead, the key process is the electrode paste printing process. The defect mode of low capacitance is caused by high degree of contraction and offset of the inner electrode layer.
In this technical report, set the W company as an example to explore the electrode paste printing process parameter settings of the MLCC 0201/X5R/0.1uF/6.3V product. The purpose is to improve yield, and reduce production cost and customer complaint frequency. Assessment of process parameters, the performance indicators used the printing uniformity and Minus standard values of printing pattern width. Under the premise of not purchase new machinery and raise the cost, decide to using 2n experimental design as method. Use the failure analysis and Cause & Effect diagram to choose the key parameters as angle of scraper, hardness of scraper, inner electrode nickel paste, print screen, and spacing of mesh. Through the professional process engineering set for each factor as different levels as high and low then arrange the experimental combination experiments by every factors and levels.
The technical report uses the statistical software Minitab to proceed 25 analysis to identify the significant factor of the printing screen gateway spacing which are with main effects and mutual interaction are significant. Finally, perform the analysis of experimental combination of professional judgment through the process engineering units based at the lowest cost and the production of a high success rate to select a printing process best production parameter conditions. angle of scraper, hardness of scraper, inner electrode nickel paste, print screen, and spacing of mesh. The scraper angle for a high standard of 80 °, scraper hardness for a high standard of 65 °, the viscosity for the inner electrode of nickel paste for the low level of 13000cps, printing screen for high standards of 640 and mesh spacing for the low level of 2mm can reduce the printing process electrical sorting out rate (defect rate) from 16% to 6%, and thus improve the whole process yield improvement for 10%, and reduce the cost about NTD 4,248,000 every year to achieve process improvement and the experimental results of parameter optimization.

並列關鍵字

Multilayer ceramic capacitor ； experimental design ； Printing process ； Minitab

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