晶圓級封裝影像感測元件捲帶包裝生產管理系統之研發

Development of a production management system of tape package for wafer level package image sensor

房志勇(Zhi-Yong Fang)

指導教授 ： 洪士林

國立交通大學/工學院/工學院工程技術與管理學程/碩士(2011年)

https://doi.org/10.6842/NCTU.2011.01098

摘要

目前半導體製造產業，所面臨的挑戰為產品生命週期及製造週期變短、策略性垂直整合營運、精確的製造服務品質等。一般晶片採用標準半導體積體電路製程，含多道元件的製程步驟，但晶片封裝廠因應不同的客戶需求，亦提供多種不同的晶片包裝方式，其中捲帶(TapeReel)包裝之出貨方式，普遍運用在表面黏著(SMT)之機台設備中。
傳統封裝方式於封裝前，一般會先經過晶粒切割作貨批之單位轉換後，再行測試、撿粒、晶粒封裝等製程後包裝入捲帶出貨。目前晶圓級封裝方式，因採整片晶圓加工之封裝特性，晶粒切割往往已近製程之末端，切割後即為可出貨之成品。因成品之體積較傳統封裝之晶粒更輕薄短小，包裝裝入捲帶前，若先經由貨批單位轉後再行上捲包裝，容易造成晶粒損壞進而影響產品之性能，且因單位轉換一般須以兩段工單接續生產，延長製造的生產週期也造成了管理上的困擾。
本研究中設計及實作一管理系統，讓貨批可以不需經由單位轉換之工單接續，可直接管理將晶圓上的晶粒包裝上捲帶之系統結構，且使用具彈性化、標準化、可重複使用之軟體元件框架與可回溯性的晶粒包裝位置記錄功能。透過元件化之系統結構，使得以與MES系統進行直接整合，使生產流程自動化且提供自動化收集生產製程資料之機制，有效解決以往晶圓級封裝廠，使用捲帶包裝出貨會衍生之成品良率不佳及生產週期延長之困擾，進而提升晶圓級封裝廠之獲利與競爭力。

關鍵字

影像感測元件 ； 晶圓級封裝 ； 捲帶包裝 ； 製造執行系統

並列摘要

The general chip manufacturer produces chips by a standard IC process flow with many level process steps. However, sometimes assembly house also provides more package services to fulfill different customer’s requests – They include a “Tape And Reel “package process adopted by SMT. equipment.
Conventional chip package flow is composed of “Wafer to Chip” unit transformation process, testing process, picking die process, chip package process and “Tape and Reel” shipping steps, whereas modern wafer level package method is to dice wafer at the end of production line due to whole wafer process property, so after processing the dicing process, the finished good will be shipped. Besides, the wafer level package method is very popular in current semiconductor industry because the chip volume of finished good is slighter and smaller than those produced by conventional chip package method. However, most of assembly houses suffer the challenge like (1) two stage working order and long cycle time issue; (2) die damage issue happens in the stages between unit transformation and “Tape and Reel” processes.
This research is to design and to implement a software system, which provides operators with “lot and wafer management capability” to handle many assembly operations from picking die to ”Tape and Reel” package processes but skips “Wafer to Chip” unit transformation process. Applying reusable software components and a flexible and standardized framework to develop die location recording and traceability functions, and integrating Manufacturing Execution System (MES), process automation module and automatic process data collection mechanism, they will effectively solve the low yield and long cycle time side effects result from Tape and Reel shipping operation in wafer level package FAB, and also increase the competitive capability on technology and profits.

並列關鍵字

Image Sensor ； Wafer level package ； Tape package ； MES

參考文獻

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