We propose a new method measuring thin film stress on flexible Substrates. The method defines the profile of the substrate by contour lines without using external force on it, and then we calculate the radius of curvature according to those contour lines. The shadow moiré method isn’t sensitive to the environment noise and has the same advantages as the interference method, such as non-destruction and easy-use. The measurement system is checked by the body whose radius is known in order to measure the correct radius of curvature in our experiments and then we will get the correct magnitude and type of thin film stress. The major computer codes are written by Labview, and it helps us getting the image signal automatically. With Labview image process technology, we remove the noise caused by laser and the optical components and increase the contrast of fringes to improve the resolution of the measurement instrument.