Surface mount technology (SMT) technology is an integral part of today's production of light, thin, small and high efficiency system in package products. This study for SMT process application failure mode and effects analysis (FMEA) through expert questionnaires prior analysis of potential failure modes, and in accordance with the FMEA implementation steps assessed the risk priority number (RPN) as much as possible in the process development the stage determines priorities failures, avoid future waste manufacturing costs. The results of this study show, failure mode "bumps empty welding" risks due to the bump gas hole factors are assessed out of priority coefficient of 99.75 for the highest, which said this is a critical factor in the SMT process most required priority to prevention of, process design and managers failure to improve prevention reference.