半導體封測產業是以生產製造為主的產業,半導體封測產業正面臨轉型與升級的壓力,勢必需要能夠快速反應、精準決策的應對各種競爭,而全球化佈局、巨大化經濟規模、轉進高階製程等經營策略即為該產業之企業所努力的目標與策略。 本研究運用雛型法開發設計並作驗證,採用雲端運算具有標準化、自動化,以及對IT 基礎架構的透明掌握度增加等特性,而這些特性在與服務導向架構(SOA)相互結合運用後,能夠提升商業智慧(BI)系統的靈活性、適應性、快速建置與整合等特質,而這正是企業所期望追求的競爭力來源。 因此本研究之SOA雲端運算服務平台適合半導體封測產業運用,可讓企業IT與企業策略作緊密結合,使資訊系統可以依據企業策略的調整作到彈性隨需的IT管理目標。
Semiconductor packaging and testing industry is a manufacturing-based industry, and is facing the pressure of the transformation and upgrading. Therefore, it inevitably needs the ability to rapid response, accurate decision-making to cope with the variously competition. The Globalization, huge economies of scale, and turning into the high-end process are the strategies/targets that enterprises in Semiconductor packing and testing industry should pursue. In this study, the development, design and validation of the prototyping method are adopting the cloud computing which have the features of standardization, automation, and the transparent management for IT infrastructure; it can enhance the flexibility, adaptability, rapid build and integration of business intelligence (BI) System, which is what companies expect to pursue the source of competitiveness, after combined use those features with service-oriented architecture (SOA). In this study, the SOA cloud services platform for the use of semiconductor packaging and testing industry which can make the closely integration between IT and business strategies and allows information system can elasticity change its IT management objectives base on the adjustment of the corporate strategy.