The purpose of this thesis is to study the etching behavior of single crystal silicon (110) and quartz (z-cut). By using micro-electronic mechanical system frabrication, we can create specific pattern on the wafer surface. According to the two dimensional etch theory, we can decide the miller indices and calculate the etch rate of any lattice plane by measuring the geometric change of the pattern. We can verify the two dimensional etch theory and establish a data sheet for the futhre work.