The shorter interconnection length and higher operation speed are the main advantages of three-dimensional integration circuits (3-D ICs). By using the technology of through-silicon-via (TSV), the memory dies can be easily stacked for 3-D IC design application. Based on the concept of linear feedback shift register (LFSR), this paper proposes a control circuit to effectively select any tier of the 3-D stacked memory for data accessing. The identity code (ID) generator, which can generate unrepeatable and predictable series codes to enable the stacked memories for tier selection, is the key component of the proposed method. Compared with the previous works, the proposed method has good performance in area overhead with less delay time penalty.