A Conservative Patched-Grid CFD Method and Its Potential Application in Electronics Cooling

貼接網格的流體分析方法及其在電子散熱上的潛在應用

陳彥升(Y. S. Chen)

《中國航空太空學會學刊》 33卷3期 (2001/09) Pp. 163-170

https://doi.org/10.6124/TAASRC.200109_33(3).03

摘要

熱流分析在電子散熱設計的領域中，已成爲從研發到零件生產的整體環節裏，不可或缺的一部分。本文提出了解析幾何形狀的複雜性及時間尺度的影響性，在流力及熱力的應用中，經由發展及實證，而能在設計應用中得到廣泛的接受。同時敘述一套適用的網格銜接的方法，用以架構流場與生熱傳熟的固體零件之間的計算分析橋樑。文中敘述一套包含共軛熱傳的計算流體力學方法。進而示範一系列數值驗證及測試的應用實例。並也對研發活用及可靠的電子散熱分析工具的課題提出討論。

關鍵字

計算流體力學模式 ； 電子散熱 ； 網格銜接法

並列摘要

Thermal/fluid analysis for electronics cooling designs has become an integral part in the research, development and manufacturing of new electronic components. Methods to resolve the geometric complexity and length/time scale differences in fluid dynamics and thermodynamics have been developed and validated in order for the general acceptance of the design analysis tools. General approaches using parched grid method to bridge the domains for the fluid flow and the heat generating/conducting solid components are described in this paper. A computational fluid dynamics (CFD) method for the solutions of the Navier-Stokes equations with conjugate heat transfer model is outlined. Some benchmark and illustrative numerical test cases are presented. Issues concerning the development of a robust and reliable design tools for electronics cooling are also discussed.

並列關鍵字

CFD Model ； Electronics Cooling ； Patched-Grid Method