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台灣半導體產業經營績效與生產力之趨勢評估-共同邊界之應用

Evaluating Operating Performance and Productivity of Taiwan's Semiconductor Industry: Using Metafrontier Function

摘要


二十一世紀後,半導體產業被我國視為重點扶植的產業之一,半導體已代替石油和鐵,成為「工業社會的稻米」。然而,2007年8月美國發生次級房貸後,緊接著2008年全球金融風暴,使得全球半導體廠商的營運狀況瞬間跌入谷底。因此,了解我國半導體產業的經營績效更顯得格外重要。本研究分別從半導體上、中、下游的角度來分析積體電路(Integrated Circui; IC)設計、IC製造及IC封測廠商靜態與動態的經營績效,藉由實證結果提供改善經營績效的方向,以及了解國內半導體供應鏈中,何者擁有較佳的經營效率及生產力。研究期間為2007年至2009年,選取上市櫃半導體廠商為研究對象。實證結果顯示:(1)群組平均效率值以IC製造廠商為最佳,IC封測廠商次之,IC設計廠商為最差。共同邊界平均效率值則是2007年以IC製造廠商的表現為最佳,2008至2009年則是IC封測廠商的表現為最佳。(2)2008年IC設計廠商共同邊界與群組邊界的平均生產力皆呈現上升現象,2009年則是呈現平均生產力下降的情形。IC製造及IC封測廠商則是呈現相反的現象;(3)IC製造及IC封測廠商的生產力深受全球景氣影響,相較下,IC設計廠商則較不受外在環境因素的影響。

並列摘要


Since the beginning of the twenty-first century, the semiconductor industry has been regarded as one of the most important industries by Taiwan. Semiconductors are substitutes for oil and iron and have become the rice of the industrial society. However, the burst of the subprime mortgage bubble in 2007 triggered the global financial storm in 2008, causing Taiwan's semiconductor output value in 2008 and 2009 to show rare negative growth. This paper will explore, from the performance evaluation perspective, the impact of the financial storm on each individual sector of the semiconductor industry. The empirical data used in this study were gathered from 132 semiconductor manufacturers that were listed on the stock market and over-the-counter market in Taiwan from 2007 through 2009. The empirical results show that IC packaging and testing companies outperformed IC design companies and IC manufacturing companies in static efficiency measurement when metafrontier is regarded as the evaluation basis during 2008 to 2009. From the viewpoint of dynamic efficiency measurement, the paper finds both MMPI and GMPI of IC design companies are rise from 2007 through 2008; but MMPI and GMPI of IC design companies are decline from 2008 through 2009. The productivity of IC design companies is less affected by the external environmental factors. In contrast, IC manufacturing and IC packaging and testing companies are deeply affected by the global recession, and productivity sharply declines.

被引用紀錄


李宗育(2017)。台灣IC設計產業效率與生產力評估-運用Dynamic Network DEA〔碩士論文,國立虎尾科技大學〕。華藝線上圖書館。https://www.airitilibrary.com/Article/Detail?DocID=U0028-2612201614280900

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