摘要
本論文致力於滾輪式微結構壓印製程探討。滾輪式壓印製程可快速將微結構轉印至基材上，目前基材只限於可撓性。本論文提出新的滾輪連續式壓印製程，在平板上轉印出微結構。滾輪板材微結構壓印先將光固化阻劑塗佈於透明平板(玻璃或透明塑膠)基材上，再通過滾輪壓印機台進行滾輪微結構壓印，壓印的同時經由UV光由下而上照射，使透明平板基材上的感光阻劑固化，而完成壓印製程。本製程成功複製三種微結構於平板上：長寬30×80μm、深40μm光柵；ø100μm、深21um微透鏡陣列；寬58μm、高6μm的U型微溝槽(U-Groove)。 本研究首先將150μm薄鎳模包覆於ø56×160mm的滾輪上進行滾輪微壓印，發現會有嚴重壓力分佈不均的情形，於是在滾輪上包覆一層橡膠軟墊做緩衝材，使壓印達到壓力均勻及完美接觸。另外鎳模與阻劑沾黏問題，需在鎳模表面蒸鍍一層鐵氟龍，經過多次壓印測試證實壓印製程無沾黏及脫膜問題。 本研究系統探討滾輪壓印製程參數對複製品質的影響。實驗結果發現：最重要的參數是平台移動速度，在本實驗機台設置下，平台移動速度在0.5~2.1mm/s以內才可成型，太快阻劑無法完全固化狀態，太慢則本機台速度不穩定。壓印壓力需大於1.2kgf/cm2以上才可成型，壓力太小可能易壓力分佈不均。 另外本實驗嚐試以兩種不同方式在板材上製作微結構：(1)以PDMS軟模當滾輪壓印模具：結果發現PDMS軟模剛性不足，容易與阻劑產生滑動現象。(2)利用熱滾輪壓印直接加熱未塗阻劑PMMA塑膠板材：結果發現塑膠板材受熱翹曲，主因是殘留應力釋放。
並列摘要
This thesis is devoted to the development of rolling micro-embossing process.Conventional rolling embossing can fast transform micro-structure on substrate, it is only limited to flexible substrate at present. In order to solve present shortcoming and restriction, one innovative method of rolling micro-embossing process was developed. The process is a carried out by applying a constant force over the roller stamp, forcing it to contact the resin-coated glass substrate and applying UV light from bottom of substrate. Three different kinds of pattern have been transferred completely on the photoresist :(i) 30×80μm dimension、40μm deep grating structure(ii)100μm diameter、21μm deep microlens array and (iii) 58μm wide、6μm deep micro U-groove features. Non-uniform pressure distribution is a problem when only nickel mould is wrapping around the 56mm diameter,160mm long steel roller. The nickel mold size is 40×40 mm and 150μm thick. By wrapping cushion pad around steel roller before attaching the nickel mold to uniform imprinting pressure throughout the whole area can be achieved. In order to reduce the sticking problem between the resist and mold, the mold was pretreated with a mold release agent Teflon. In this study, it is found that the platform speed is the most important processing parameter since curing time is critical. The micro-structure can be replicated when platform speed is between 0.5~2.1mm/s. The embossing pressure should be above 1.2kgf/cm2 to achieve uniform pressure.