構 裝 接 線 與 接 腳 的 等 效 電 路 模 型 擷 取
與 分 析

許多關於構裝以及其他不連續的全波分析的論文已被發表，大多數著重於封裝的某一部份或是單根封裝接線，但是較少提到封裝或是系統中多樣相互影響的架構分析。此外，在信號趨於高速時，封裝接線間電磁相互影響在高頻時會造成相當大的影響，銲線所造成的不連續也會顯著地限制整個電路的高頻表現，並且必須在初期設計封裝電路時，將之列入考量。故在平行與垂直耦合情況下，關於耦合封裝金線以及封裝腳位的模型，本論文裡提供擷取構裝接線以及接腳的等效電路的分析方法。論文中，吾人使用Ansoft公司的HFSS(以有限元素法計算)軟體來模擬電子構裝金線的高頻全波特性，而以Q3D得到封裝接腳的等效電路模型。因此，可以快速建立封裝金線以及封裝腳位的等效電路模型。此外，藉著改變構裝接線的尺寸，可以得到構裝接線等效電路模型寄生電感與電容的值與幾何結構的關係，因此可以列出一個與幾何參數有關的構裝接線等效電路的圖表，在此論文中也將一併探討。

關鍵字

封裝；構裝接線；晶片；互連結構

並列摘要

Recently, many contributions have been made in the full-wave analysis of package and interconnect discontinuities. Most of these contributions presented analysis of one aspect of package or one bonding wire, but very few account for multiple interacting structures of a complete package or electronic system. In addition, when the applied signal is trending to the high frequency region, electromagnetic interactions between all the bonding wires can cause the serious effects at high frequencies. The discontinuity induced by the bonding wires can significantly limit the high-frequency performance of the whole circuit and must be taken into account in the early stage of packaging designs. The exploration of extracting the model of a single bonding wire and two bond ing wires while parallel coupling and perpendicular coupling is investigated in the thesis. A method is presented to extract the equivalent circuit of bonding wires and package pin in the thesis. The Ansoft High Frequency Structure Simulator (HFSS), using the finite element method (FEM), is employed to obtain the full-wave electrical characteristics of bonding wires in the high frequency. So be the equivalent circuit model of packaging pins obtained by Q3D. Therefore, the equivalent circuit models of bonding wires and packaging pins could be established quickly. Furthermore, the inductance and capacitance values of equivalent circuit models are obtained by scaling the dimension of bonding wires. Accordingly, the lookup database of equivalent circuit’ model verse the geometrical setting of bonding wire is presented for packaging designers.

並列關鍵字

packaging ； Bonding wire ； die ； interconnection

參考文獻

[1] Z. Mu, and K. Willis, “SI and considerations for Gbps PCBs in communication systems,” IEEE Proc. Electrical Performance of Electronic Packaging, pp. 287-290, 2001.

[2] R. Vahldieck, S. Chen, H. Jin, and P. Russer, “Flip-chip and bond wire/airbridge transitions between passive microwave transmission lines and laser diodes,” in 25th European Microwave Conf., Bologna, Italy, pp. 875-878, Sept. 1995.

[3] T. Krems, W. Haydl, H. Massler, and J. Rudiger, “Millimeter-wave performance of chip interconnections using wire bonding and flip chip,” in IEEE MTT-S int. Microwave Symp. Dig., vol. 1, San Francisco, pp. 247-250, CA, June 1996.

[4] G. Baumann, D. Ferling, and H. Richter, “Comparison of flip chip and wire bond interconnections and the technology evaluation on 51 GHz transceiver modules,” in 26th European Microwave Conf., vol. 1, Prague, Czech Republic, pp. 98-100, Sept. 1996.

[5] G. Strauss and W. menzel, “ A novel concept for MM-wave MMIC interconnects and packaging,” in IEEE MTT-S Int. Microwave Symp. Dig., San Diego, CA, pp. 1141-1144, May 1994.

國際替代計量

構裝接線與接腳的等效電路模型擷取與分析

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