台灣地區四面環海,自產能源貧乏,極度仰賴能源進口再加上目前的工業部門產業結構已轉變為以高科技、高耗能的電子產業為主。1997年12月製定的京都議定書,使得節能減碳變成全球不容重視的課題,因此如何提升能源效率,降低生產成本,提高國際競爭力乃是目前各電子廠積極進行的工作。 本研究調查12”半導體矽晶片(Electronic-Grade Si Wafer)、DRAM記憶體模組(DRAM Module)、光罩(Photomask for silicon wafer)等三種產品之單位耗能指標,並提供指標性的量化數據,期能提供業界參考,以提昇台灣電子業的能源效率,降低環境負荷量及增加業界競爭力;另外著重於DRAM供應鏈之耗能(12”半導體矽晶片、DRAM晶圓製造、IC封裝、IC測試、記憶體模組組裝及硬質多層印刷電路板)及其CO2之排放量。 結果顯示, DRAM供應鏈之產品單位耗能為4.67 kWh/PCS,以本研究調查之年出貨量85,136,366 PCS計算,2008年總共消耗了397,331,726 kWh的能源,排放了252,703噸的CO2。
Taiwan is surrounded by sea, due to lack of natural resources, it extremely depends on importing sources of energy. Also, the main industry structure transformed to high technical and highly-energy-exhausted electronic industry. Kyoto Protocol, which established in December, 1997, emphasize the importance of Global issue “Energy Saving and Carbon Emission Reduction”; therefore, all electronic plants are all focus on how to improve the energy efficiency, decrease production cost, and being more competitive throughout countries. In this study, we survey three products, which are 12”Electronic-Grade Si Wafer, DRAM Module and Photomask for silicon wafer in order to provide a specific energy consumption data as a reference for the related fields. Through this series of information, we could improve energy efficiency, decrease environmental load, and also become more competitive in Taiwanese electronic industry; moreover, we focus on SEC for all major energy consumption sectors in the DRAM supply chain, include silicon wafer (ingot), wafer fabrication, IC assembly, IC testing, Modulization, and PCB. Results show that the energy consumption of a single unit of products from DRAM Supply Chain is 4.67 kWh/PCS. Based on the annual shipment (85,136,366 PCS/yr), we find the whole DRAM supply chain consumes a total of 397,331,726kWh of energy, emitting 252,703 tons of CO2.