本文的目的是陶瓷雷射燒結法(CLS)製作生坯與生工件之顯微結構分析,證明未經雷射掃描之生坯較雷射掃描之生工件堆積密度更加均勻,然後以雷射輪廓掃描取代現有用於CLS之點陣掃描於陶瓷生坯進行製程之改善。 本研究成功地開發出選擇性雷射弱化製程。在陶瓷漿料中添加交聯劑戊二醛,強化PVA之耐水性與機械性質;製程參數則以雷射功率5.5W,輪廓掃描速度25mm/sec,以重複雷射掃描兩次的方式使掃描路徑中之PVA與戊二醛完全燒失,剩下氧化鋁粉殘留成為弱化區,再利用超音波震盪將此弱化區與其外側之生坯予以清除,弱化區內部之生坯則成為所製作之生坯工件。以此製程方式成功地製出半徑6mm的半圓球陶瓷工件,透過1600℃高溫緻密化燒結後,其緻密度可達99.2%。由此可證,此新製程不但可行,且與以前的選擇性雷射燒結製程比較,可大幅縮短製作時間。
The aim of this paper is to analysis microstructure of the green portion and the green part fabricated with the process of Ceramic Laser Sintering (CLS), and to verify that the packing density of un-scanned green portion is more uniform that that of the green part fabricated with laser scanning. Then, replacing raster scanning employed in CLS to contour scanning to improve the process was studied. This study successfully developed a process of Selective Laser Weakening. The slurry was composed of ceramic powder, PVA as a binder and glutaraldehyde as a cross-linking agent to enhance the water-resistance and mechanical property of the PVA. The process parameters were the laser power of 5.5W, contour scanning speed of 25mm/sec. Laser scanning was repeated twice to completely bun out glutaraldehyde and PVA contained in the scanning path. The remaining in the scanning path was alumina powder to form a weakening zone. Consequently, the green portion outside the weakening zone was removed with weakening zone by an ultrasonic cleaner. This process had successfully fabricated a semi-spherical ceramic part with radius of 6 mm. After sintering at 1600℃ for densification, the density of 99.2% was achieved. The result verified the feasibility of the new process. Comparing to the existing process of CLS, building time could be shorted dramatically.