本研究發展一運用數位微鏡組裝置(DMD)的數位條紋投射技術,結合聚焦形貌量測原理,發展一全域式微尺寸物體之三維表面輪廓量測系統。精確的三維表面輪廓量測對微機電或半導體產品日漸重要,其關係到產品的品質與生產效率。有鑑於傳統的光學三維量測技術所採用的雷射光源,容易因待測物表面形狀不連續的部份而產生散射的問題。新的主動式光源以DMD為基礎,具備高彈性,可自由調整結構光圖案以及動態光強等特性,可適應於不同表面特性之待測物。以聚焦函數評估影像點的強度值,對應待測物之實際高度位置,可精確且有效率的完成待測物表面三維量測,以實際運用於半導體工業之微細元件進行量測,驗證量測系統的精度與性能。量測系統之空間解析可達0.08μm/pixel,最大量測誤差為0.0736μm,量測平均誤差為0.0706μm,重覆性量測誤差為±0.112μm。
An innovative full-field three-dimensional micro surface profilometer using digital fringe projection with digital micromirror device (DMD) technology and confocal principle is presented in the article. In viewing the fact that conventional laser confocal measurement method not only easily encounters undesired irregular scattering problems being introduced by object's surface discontinuities, the newly developed profilometer deploys a DMD chip to project digital fringe patterns with dynamic light intensity control, onto the object to obtain excellent measurement performance. A novel digital fringe pattern design with sinusoidal intensity modulation, to obtain optimized depth resolution with a micrometer lateral resolution. Some of important semiconductor components have been measured to attest the feasibility of the developed approach. The depth measurement resolution can reach better than 0.08μm and the average measured error was verified to be 0.0706μm of the vertical full-scale measurement range.