薄膜電晶體液晶顯示器(Thin-Film Transistor Liquid crystal Display:簡稱TFT-LCD)為台灣二兆雙星重要發展的產業,因應未來第六代或是第七代以上大尺寸LCD面板的封裝製程(Cell Processes)的需求,液晶滴入式(One Drop Filling:簡稱ODF)封裝製程技術將會取代現行傳統LCD面板封裝製程。除了液晶材料的改良之外,其中又以紫外光和熱雙效硬化型樹脂(UV and Heat Curable Resins)做為組立製程(Assembly Processes)中ODF封膠材料,為下世代面板製程研究技術的關鍵課題。 實驗中,將探討以紫外光和熱雙效硬化型樹脂主要組成為寡聚物(Epoxy Acrylate Oligomer)為主的ODF封膠材料,將其塗佈在玻璃基板上形成薄膜,經過紫外光不同曝光時間及在恆溫120℃下不同加熱時間,再以衰減全反射式傅立葉轉換紅外線光譜儀(Attenuated Total Reflection-Fourier Transform Infrared Spectroscope)分析乙烯基和環氧基相關官能基在吸收圖譜的變化,探討在不同環境條件下ODF封膠材料硬化反應程度以及分析鑑定的要素。 由最終結果可明顯觀察到,可以觀察出不論紫外線曝光時間10秒或是至60秒其紅外線吸收圖譜並不會有其它差異。此外,在恆溫120℃下加熱60分鐘時間,則可達到硬化程度90%以上,由此結果可做為組立製程條件設計參考的重要依據。
Recently , TFT-LCD(Thin-Film Transistor Liquid crystal Display) is very important to major industries in Taiwan . In order to of satisfy the panel manufacture industry requiring large sizes of panel of cell processes , the conventional processes will be replaced with new technology of cell processes : One Drop Filling (Abbreviation:ODF) in the future . It is important to develop UV/Heat curable resin. In this investigations , we focused on Epoxy Acrylate Oligomer which are major components of ODF Sealant materials. The films are exposed to UV by different times , then the absorption peaks of ethylene and epoxy function group were idendifed with Attenuated Total Reflection-Fourier Transform Infrared Spectroscope to discuss curing ratio and reaction condition . The result show that the IR spectrum was not changed even through 10 to 60 seconds of UV light exposure . On the other hand , the curing ratio was over 90% when it was heated at 120℃ for 60 minutes. This result can be used as a design standard.