晶圓探針測試之溫度影響探討及改善方案

An Investigation in Temperature Effects with an Improvement Approach of Wafer Probing Test

王政龍(Cheng-Lung Wang)

指導教授 ： 籃山明

中原大學/工學院/電子工程研究所/碩士(2012年)

https://doi.org/10.6840/cycu201200732

摘要

在先進製程裡的測試流程，導入高低溫測試已成為必要的課題。高低溫度變數下的測試常面臨的問題卻是良率不佳，其成因往往是接觸不良所造成。本研究透過銲墊上針痕的觀察，提供業界面對溫度變數下除了設計端元件的溫度特性曲線之外，指出測試配件與架機設定等測試環境的因素也是影響測試良率的一個主要因素。藉由透過觀察配件的變形，比較各種造成良率降低的元素間造成的影響，針對其中某些環境條件提出更好的解決方案，並提出對策改善降低環境對良率的影響。

關鍵字

銲墊刮痕 ； 探針卡 ； 針測行程 ； 探針預熱

並列摘要

In the testing flow of an advanced process, the testing under high and low temperature has been become a necessary issue for testing. Testing under variables of high and low temperature is often confronted with the problem of low yield ratio, which is caused often by poor contact. Through observation of probe marks on the bonding pad, this study suggested that when facing the temperature variable, besides the temperature characteristic curve of the components at the design end, the factors of testing environments, such as testing devices and machine settings, are main causes affecting the yield ratio of testing. After observing the deformation of components and comparison of effects caused by various factors, which result in a low yield ratio, this study proposed a better solution for some factors and measures to overcome the effects of environmental factors on the yield ratio.

並列關鍵字

overdrive ； bonding pad scratch ； probe card ； probe preheating

參考文獻

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