可撓式塑膠基板上製備有機/無機多層水氣阻障層之機械撓曲特性研究

Study on Mechanical Properties of Organic/inorganic Multilayered Barrier Structures Deposited on Flexible Plastic Substrates

廖仁懋(Ren-Mao Liao)

指導教授 ： 劉代山

國立虎尾科技大學/電機資訊學院/光電與材料科技研究所/碩士(2012年)

摘要

本研究利用電漿增強化學氣相沉積系統（Plasma-enhanced chemical vapor deposition; PECVD），在可撓式塑膠基板上製備有機矽基/無機氧化矽多層氣體阻障層薄膜，並藉由調變有機矽基薄膜厚，以有效的控制張應力/壓應力多層薄膜之殘留應力，並且找出最佳化具低應之力三對有機/無機多層水氣阻障層薄膜，並利用彎曲測試儀器探討氣體阻障層薄膜於不同撓曲曲率及彎曲次數後的機械可靠度特性。研究結果顯示，當多層結構採用最佳化三對有機/無機多層水氣阻障層時，其薄膜內殘留應力為-200 MPa，且薄膜於PET塑膠基板上之附著度可達至5B等級，並以鈣測試法（Calcium test）量測此多層鍍膜之水氣滲透率，經由放置十四天於室溫環境下，其中最佳化具低應之力三對對有機/無機多層膜結構擁有最低水氣滲透率為4.37×10-4 g/m2/day。另一方面，在機械撓曲破壞的研究結果顯示，最佳化具低應之力三對對有機/無機多層膜結構於撓曲曲率半徑為20 mm條件下，其水氣阻障能力並沒顯著劣化的現象，並且經由循環撓曲次數為1000次後，仍然維持良好的水氣阻障能力，並且薄膜附著度仍維持5B等級，顯示出多層薄膜結構沉積在可撓式塑膠基板上具有優異的撓曲可靠性。最後，將本研究開發之具低應力之三對有機矽基/氧化矽薄膜結構應用於有機發光二極體（Organic light emitting diode; OLED）的封裝製程中，相較未封裝有機發光二極體，其壽命可以從200 hr提升至950 hr，並於可撓式發光二極體上能夠提升其元件操作壽命達40倍以上，因此，從上述實驗結果可以發現，顯示出藉由具有低應力之多對有機/無機多層水氣阻障層結構更能有效地提升可撓式塑膠基板的氣體滲透阻隔性及提升有機發光二極體壽命的能力。

關鍵字

電漿增強化學氣相法 ； 水氣阻障層 ； 二氧化矽 ； 殘留應力 ； 撓曲測試 ； 發光二極體封裝

並列摘要

In this study, an organosilicon/silicon oxide (SiOx) thin film prepared using plasma-enhanced chemical vapor deposition (PECVD) using tetramethylsilane (TMS) monomer and TMS-oxygen gas mixture was consecutively deposited onto the flexible plastic substrate and applied to encapsulate organic light-emitting diode (OLED). In first , with the aim to prepare a gas barrier structure with a low residual internal stress, high bending reliability, and ultra-low water vapor transmission rate (WVTR), we develop a novel organosilicon layer plasma-polymerized using TMS monomer to buffer the residual internal stress of the barrier structure. The mechanism responsible for the pairs of the organosilicon/SiOx structure achieved an ultra-low WVTR (< 10-4 g/m2/day) and high bending reliability (after bending 1000 times) as a function of the organosilicon layer thickness will be comprehensively studied. Second, such pairs of the organosilicon/SiOx barrier structure will be employed as an encapsulated layer for the OLED packaging application. Firstly, the operating life-time of the encapsulated OLED device based on the laminated barrier-coated lid packaging method will be measured and discussed. Eventually, the stacked organosilicon/SiOx barrier structure, which possesses an ultra-low WVTR and high mechanism reliability, directly deposited onto the OLED device according to the monolithic thin film packaging method will be carried out to realize the thin film packaging for the flexible optoelectronic devices.

並列關鍵字

plasma-enhanced chemical vapor deposition ； tetramethylsilane ； flexible plastic substrate ； organosilicon/silicon oxide gas barrier structure ； organic light-emitting diode ； bending reliability ； water vapor transmission rate ； laminated barrier-coated lid packaging ； monolithic thin film packaging

參考文獻

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