本研究利用分子動力學模擬掃描探針微影術對於鋁、鎳薄膜的動態壓痕與刮痕特性。模擬結果發現,當壓痕的深度增加,正向力與黏著力也會增加;且壓痕速度越快時,負載力與黏著力亦跟著增加。自由層薄膜比調溫層薄膜有較小的負載力與較大的黏著力。鎳膜比鋁膜有更大的塑性變形。實驗部份,探針正向力設為30 ~ 45 nN,在鋁膜上刮痕出奈米結構且深度在150~200 nm。實驗結果部份也利用探針成為動態奈米切削工具,使用動態奈米壓痕與掃描探針微影術做出奈米結構,像是奈米空孔、奈米線、奈米溝槽。
This study presents the use of molecular dynamics (MD) to simulate the dynamic nanoindentation and nanoscratch characteristics of Al and Ni thin films using mechanical scanning probe lithography (SPL). The simulation result shows that when the depth of indentation increased, the normal load and the adhesion force increased. When the speed of indentation was increased, the loading and adhesion force also increased. The result of the free/thermal layers model had a smaller normal force and higher adhesion force than that of thermal layers model during the dynamic indentation. The plastic deformation of the Ni films was much larger than that of the Al films. In the experimental result, we used different normal loads of 30~45 nN to scratch the nanostructures on the Al films at depth of 150~200 nm. The experimental results identified the probe could be as a dynamic nanocutting tool. The nanostructures such as nanocaves, nanowires, and nanogrooves had been achievied by using the dynamic nanoindentation and mechanical scanning probe nanolithography.