This study simulates high power LED array with two types of heat sink by CFD (Computational Fluid Dynamics) code and compares the results with adopting the method of thermal circuits. We analyze average junction temperature by selecting different size of heat sink and discuss the thermal behavior about LED array modules which are forward lighting with plate and cylinder pin fin heat sink. The results show that total thermal resistance decreases with higher fin height and the fin numbers, thickness and diameters locate on the optimum range. In addition, the prediction of thermal circuits is in good agreement with the simulation from CFD code.