The main purpose of this research is to investigate the effect of potassium iodide (KI) and polyvinyl alcohol (PVA) on the plating rate, surface morphology, composition and resistivity of copper deposition. The results of adding potassium iodide and polyvinyl alcohol as additives to the borate buffered electroless copper plating solutions are that the plating rate was decreased, the surface morphology of copper deposition was smoothed and the structure of plating solution became denser. Another purpose of this study that is applying the electroless copper plating to the aspect of electromagnetic interference (EMI) shielding. It's found that by adding two additives PVA and KI together to the plating bath, EMI shielding effect (SE) is increased from 50dB to the best SE of 78.7dB.