Nd: YVO4 雷射應用於精微加工之特性分析

Characteristics Analysis of Using Nd: YVO4 Laser for Micro Machining

戴金玲(Chin-Ling Tai)

指導教授 ： 王世明

中原大學/工學院/機械工程研究所/碩士(2011年)

https://doi.org/10.6840/cycu201100796

摘要

和機械切削比較，雷射加工其特色為非接觸式加工，加工後無碎屑殘留也不需做清洗等後續處理，可加工出更精細的圖案，經常被用來取代傳統製程所無法完成應用。但奈秒雷射屬於長脈衝雷射，其熱效應會嚴重影響加工精度及材料性質，因此幾乎都需要在加工後再加以移除，使加工變的繁複。本研究分析奈秒雷射加工參數、功率與能量對不鏽鋼材料加工後表面結構及和品質的影響，提出以曲線擬合方式尋找最適合加工參數的方法，以可得較佳的溝槽深度和最小的火山口現象。研究中同時也加入水輔助加工方式，發現其可將溝槽深度大幅提升為在空氣中雷射加工的17倍，並大大改善了奈秒雷射的熱效應，也無水中雷射加工特有的層狀結構，非常適用於精微加工，解決了奈秒雷射加工上精度不佳的問題，只需要低成本及簡單的環境，即可達到接近超快雷射加工出的精度及表面品質。

關鍵字

熱影響區 ； 重鑄區 ； 曲線擬合 ； 奈秒雷射 ； 水輔助雷射加工法

並列摘要

Compared with mechanical machining, laser machining is with the characteristics of non-contact, no residual chips, no cleaning needed, and more accurate. However, because nanosecond laser is a long pulse laser, it usually induces thermal effects which will deteriorates the machining accuracy and the material properties of the workpiece. Thus, it is very important to develop a method to minimize the influence of the thermal effect. In the research, the influence of processing parameters of nanosecond laser processing, laser power, and pulse energy on the machining performance and material properties was first explored. Subsequently, curve fitting method was applied to develop a method to obtain optimal processing parameters for deeper groove and minimized recast layer. Furthermore, the water-assisted method was added, and the results have shown that it can have 17 times machining depth than having laser processing in air. Besides, it also significantly decreases the thermal effect. By observing the morphology and topography of the machined workpiece, it was found that there was almost not a crater and a layered structure. The proposed method provides high surface quality, good accuracy, deeper depth, and good stability for nanosecond laser processing. It makes nanosecond laser processing more suitable for micro machining application with the advantages of low cost and use in simple surroundings.

並列關鍵字

curve fitting ； nanosecond laser ； water-assisted laser processing ； recast layer ； heat-affected zone

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