應用Web Services實施資料交換之比較研究—以半導體封裝測試產業為例—

A Comparative Study on Data Exchanging System Using Web Services—Implementation on a Semiconductor Assembly and Final Testing Firm—

林英傑(Ying-Chieh Lin)

指導教授 ： 劉士豪

中原大學/商學院/資訊管理學系/碩士(2006年)

https://doi.org/10.6840/cycu200600320

摘要

台灣的經濟競爭力長久以來是建立在一個“快”的基礎上。然而，隨著市場環境的變遷，以及企業規模、型態的轉變，這樣的優勢早已受到質疑，企業往往無法反應因資訊科技的變化所帶給市場的快速變遷，進而失去跨入新市場的先機。相對的身為兩兆產業（半導體、影像顯示產業）之一的半導體產業也不例外，資料交換的零時差、準確性以及即時的反應問題便是企業開創新商機的競爭優勢之一，隨著專業分工時代的來臨，半導體產業架構已從過去垂直整合（IDM）的方式改變成垂直專業分工的趨勢，所以實施上下游相關廠商之間的協同合作機制更是現今半導體產業必備的條件。
然而資訊科技的快速變化，相關軟體工程技術日新月異，往往導致企業花費大筆的經費來整合企業內部與外部的資訊系統資源，但也因此解決了當前的問題而又造就了另一問題。經過本研究對半導體產業現象的觀察與對個案深入了解後，發覺現階段半導體產業間實施晶圓製造的相關測試資料交換的平台系統上，仍有許多待突破的問題，例如：系統建置成本過高、彈性不太、無法即時反應問題以及提供即時回應機制、沒有一套整合標準規範等問題。
本研究屬於探索性的研究，主要目的是希望能應用目前新的資訊技術「Web Services」，藉由其跨平台整合的優勢、開放式的標準以及簡單化的優勢等特性來建置晶圓製造的相關測試資料交換的平台系統，並比較目前半導體產業既有的平台系統之間的優劣點即差異。

關鍵字

晶圓測試資料 ； 網路服務 ； 協同合作機制

並列摘要

Taiwan's economic competitiveness is based on a "fast" basis for a long time. However, as the market environment changes, scope of enterprise changes and business patterns change, such an advantage has been questioned, enterprises are often unable to reflect the changes brought by information technology to the rapid market changes, thus losing the opportunity to enter new markets. As semiconductor industry is one of the 2 trillion industry (semiconductors, TFT-LCD industries) has no exceptions, Zero time data exchange, data accuracy and real-time response are the competitive advantages for enterprises to create new business opportunities, as the market tend to be specialized the structure of semiconductor industry has changed from the vertical integration (Integrated Device Manufacture) approach into vertical specialization trends. So as a result the mechanisms of implementation and collaboration between enterprise and its downstream manufacturers will be a key factor toward the success.
The rapid changes in information technology often leading the enterprises to spend large amount of money to integrate their internal and external information systems and resources, but the result often resolved the current problems and created another new problem. After observation and understanding the case in depth of industry's phenomenon through this research, found that at the present stage the platform for exchanging wafer map information between semiconductor industries is still having lots of problems and much remains to be breakthroughs, such as : system instituted by high costs and less flexibility, can not real-time response to client side and provide immediate response mechanisms, no integrated standards and so no.
This is an exploratory research, the main purpose of the research is to present the new Information Technology「Web Services」, through its cross-platform integration advantages, open standards and simplification advantages to build up a systematic platform for exchanging the related semiconductor wafer map informations and compare with the current industry's platform and find out the advantages and disadvantages.

並列關鍵字

Collaboration ； Wafer Map Information ； Web Services

參考文獻

10. 王之怡，「智慧型網路服務搜尋系統」，中原大學資訊工程研究所碩士論文，民國91年6月。

11. 楊翰林，「應用Web Services實施企業間電子化之比較研究－以電子製造業為例」，中原大學資訊管理研究所碩士論文，民國93年。

12. 戚玉樑，賴德優，「建置網路服務整合的協同平台（CCP）-以元件技術及工作流程為基礎」，2003年。

18. Francisco Curbera, Matthew Duftler, Rania Khalaf,William Nagy, Nirmal Mukhi, and Sanjiva Weerawarana, “Unraveling the Web Services Web:An Introduction to SOAP,WSDL, and UDDI”, IEEE Internet Computing, pp. 86-93, 2002.

20. Hongbing Wang, Joshua Zhexue Huang, Yuzhong Qu, Junyuan Xie, “Web Services: problems and future directions”, Journal Of Web Semantics, pp. 309-320, 2004.